Texas Instruments DAC 3202 Series, Manual

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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
V
DD
Supply voltage, V
DD
to A
GND
–0.3 6 V
Digital inputs to A
GND
–0.3 V
DD
+ 0.3 V
CAP to A
GND
–0.3 1.65 V
V
FBX
to A
GND
–0.3 V
DD
+ 0.3 V
V
OUTX
to A
GND
–0.3 V
DD
+ 0.3 V
V
REF
External reference, V
REF
to A
GND
–0.3 V
DD
+ 0.3 V
Current into any pin except the OUTx pins –10 10 mA
T
J
Junction temperature –40 150 °C
T
stg
Storage temperature –65 150 °C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply
functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.
If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully
functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
6.2 ESD Ratings
VALUE UNIT
V
(ESD)
Electrostatic
discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins
(1)
±2000
V
Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002, all pins
(2)
±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
V
DD
Positive supply voltage to ground (A
GND
) 1.7 5.5 V
V
REF
External reference to ground (A
GND
) 1.7 V
DD
V
V
IH
Digital input high voltage, 1.7 V < V
DD
≤ 5.5 V 1.62 V
V
IL
Digital input low voltage 0.4 V
C
CAP
External capacitor on CAP pin 0.5 15 μF
T
A
Ambient temperature –40 125 °C
6.4 Thermal Information
THERMAL METRIC
(1)
DACx3202
UNIT RTE (WQFN)
16 PINS
R
θJA
Junction-to-ambient thermal resistance 49 °C/W
R
θJC(top)
Junction-to-case (top) thermal resistance 50 °C/W
R
θJB
Junction-to-board thermal resistance 24.1 °C/W
Ψ
JT
Junction-to-top characterization parameter 1.1 °C/W
Ψ
JB
Junction-to-board characterization parameter 24.1 °C/W
R
θJC(bot)
Junction-to-case (bottom) thermal resistance 8.7 °C/W
(1) For information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
DAC53202, DAC63202
SLASF47 – MAY 2022
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