Texas Instruments bq76200, User Manual, Page: 9 / 21

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bq76200EVM Circuit Module Schematic
4 bq76200EVM Circuit Module Schematic
This section contains information on other EVM features.
4.1 Alternate FETs
The EVM has D2PAK and TO-220 footprints for power FETs as options for evaluation. A DPAK footprint
option is available as a precharge FET option.
4.2 Heatsink Patterns
The EVM is designed with copper plane areas to distribute heat on the board. The board has a hole
pattern for an optional bolt on heatsink H9 shown in the
bill of materials . The board also has patterns on
the top layer for D2PAK heatsinks HS10 and HS11 shown in the bill of materials . The flat areas of the
back of the board may be used for adhesive mount heatsinks, if appropriate.
4.3 PACK Transient Pattern
D2 is a pattern for a TVS on the pack, if desired.
4.4 Input Limit Circuit
The bq76200 EVM contains zener diodes and resistors on the inputs. These may limit the voltage to the
control input pins if multiple pins on the IC are shorted together and the ground connection is maintained,
but do not provide a safety isolation boundary. The zeners are not intended for protection of the inputs to
the IC.
9 SLVU926 – July 2015 bq76200 High Voltage Battery Pack Front-End Charge/Discharge High-Side
NFET Driver Evaluation Module
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