Texas Instruments BQ25120A, Manual, Page: 7 / 73

(2) These inputs will support 6.6 V for less than 10% of the lifetime at V
(BAT)
or VIN, with a reduced current and/or performance.
8.4 Thermal Information
THERMAL METRIC
(1)
BQ25121A
UNIT YFP (DSBGA)
25 PINS
R
θJA
Junction-to-ambient thermal resistance 60 °C/W
R
θJC(top)
Junction-to-case (top) thermal resistance 0.3 °C/W
R
θJB
Junction-to-board thermal resistance 12.0 °C/W
ψ
JT
Junction-to-top characterization parameter 1.2 °C/W
ψ
JB
Junction-to-board characterization parameter 12.0 °C/W
R
θJC(bot)
Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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BQ25121A
SLUSDA7A – APRIL 2018 – REVISED JANUARY 2021
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