Introduction
2
SNAU229 – December 2017
Copyright © 2017, Texas Instruments Incorporated
BOOSTXL-ADS7841-Q1 BoosterPack™ User's Guide
1
Introduction
The BOOSTXL-ADS7841-Q1 BoosterPack™ is a fully-assembled evaluation platform designed to
highlight the ADS7841-Q1 device features and its various modes of operations.
The BOOSTXL-ADS7841-Q1 EVM interfaces to the TM4C1294 LaunchPad™ Development Kit (
). The Tiva C Series TM4C1294 MCU on the TM4C1294 LaunchPad™ communicates with
the ADS7841-Q1 through its SPI interface and acts as a USB-to-PC GUI communication bridge.
NOTE:
The BOOSTXL-ADS7841-Q1 requires an external master controller to evaluate the
ADS7841-Q1.
The TM4C1294 LaunchPad™ is controlled by commands received from the BOOSTXL-ADS7841-Q1 EVM
GUI, and returns data to the GUI for display and analysis. If the TM4C1294 LaunchPad™ is not used, the
BoosterPack plug-in module format of the BOOSTXL-ADS7841-Q1 board allows an alternative external
host to communicate with the ADS7841-Q1.
The BOOSTXL-ADS7841-Q1 EVM incorporates all required circuitry and components with the following
features:
•
ADS7841-Q1 12-bit, 4-channel, automotive qualified SAR ADC with SPI interface
•
Optional low power voltage reference, TI’s REF5045A, to generate a 4.5-V reference for the ADS7841-
Q1 VREF pin when using 5.0 V from TM4C1294 LaunchPad™
•
Optional precision, low noise, dual operational amplifier, TI's OPA2320, to generate buffered input for
the ADS7841-Q1 AIN0 and AIN2 pins
•
Optional adjustable linear regulator, TI’s TPS79901, to generate stable 5V output voltage to power the
ADS7841-Q1 VCC pin when using the USB power from the TM4C1294 LaunchPad™
•
SPI interface for communication and configuration of modes available on the ADS7841-Q1
shows the BOOSTXL-ADS7841-Q1 EVM architecture, identifying the key components and blocks
previously listed.