Texas Instruments AN-1922 LM48511 User Manual Download Page 10

PCB Layout Guidelines

www.ti.com

9

PCB Layout Guidelines

This section provides general practical guidelines for PCB layouts that use various power and ground
traces. Designers should note that these are only “rule-of-thumb” recommendations and the actual results
are predicated on the final layout.

9.1

Power and Ground Circuits

Star trace routing techniques can have a major positive impact on low-level signal performance. Star trace
routing refers to using individual traces that radiate from a signal point to feed power and ground to each
circuit or even device.

9.2

Layout Helpful Hints:

1. Avoid routing traces under the inductor.

2. Use three separate grounds that eventually connect to one point:

(a) Signal or quiet ground (GND2)

(b) Ground for the LM48511 device (GND1)

(c) SW (GND3) (switch ground). This trace for the switch ground carries the heaviest current (3A) and

therefore is the nosiest. Make this trace as wide and short as possible and keep at a distance from
the quiet ground and device ground. Give distance priority to the quiet ground.

10

Bill Of Materials

Designator

Description

Footprint

Qty

Value

Cf1

CHIP CAPACITOR GENERIC

CAP 0805

1

470pF

CINA

CHIP CAPACITOR GENERIC

CAP 1210

1

1

μ

F

CINB

CHIP CAPACITOR GENERIC

CAP 1210

1

1

μ

F

Co

CHIP CAPACITOR GENERIC

CAP 1210

1

10

μ

F

Cs1

CHIP CAPACITOR GENERIC

CAP 1210

1

2.2

μ

F

Cs2

CHIP CAPACITOR GENERIC

CAP 1210

1

4.7

μ

F

D1

SCHOTTKY DIODE

DIODE MBR0520 IR

1

L1

IND_COILCRAFT-DO1813P

1

4.7

μ

H

R1

CHIP RESISTOR GENERIC

RES 0805

1

41.2K

R2

CHIP RESISTOR GENERIC

RES 0805

1

13.3K

RINA

CHIP RESISTOR GENERIC

RES 0805

1

150K

RINB

CHIP RESISTOR GENERIC

RES 0805

1

150K

11

Demonstration Board PCB Layout

Figure 3

through

Figure 8

shows the different layers used to create the LM48511SQ demonstration board.

Figure 3

is the silkscreen that shows component locations on the board’s top surface.

Figure 4

is the

metal Top Layer.

Figure 5

is the metal Midlayer 1.

Figure 6

is the metal Midlayer 2.

Figure 7

is the metal

Bottom Layer.

Figure 8

is the silkscreen that shows component locations on the board bottom.

10

AN-1922 LM48511 Evaluation Board

SNAA064C – November 2008 – Revised May 2013

Submit Documentation Feedback

Copyright © 2008–2013, Texas Instruments Incorporated

Summary of Contents for AN-1922 LM48511

Page 1: ...1SQ Demonstration Board 2 Quick Start Guide Step 1 Apply a 3 0V to 5 5V power supply voltage to the VDD pin with respect to the ground GND pin Step 2 Set connectors SD_Amp SS_En Enable SD_Boost to Hig...

Page 2: ...rtable devices such as GPS mobile phones and MP3 players The high 80 efficiency at 5V extends battery life when compared to boosted Class AB amplifiers Independent regulator and amplifier shutdown con...

Page 3: ...cuit 7 Connections Table 1 LM48511 Demonstration Board Connections Designator Function or Use Supply Voltage VDD The supply voltage operating range is from 3 0V to 5 5V but the absolute maximum rating...

Page 4: ...e 1 LM48511 Demonstration Board Connections continued Designator Function or Use Set the FB_SEL High for PV1 VFB 1 25 5k 4 87k where VFB 1 23V FB_SEL Set the FB_SEL Low for PV1 VFB 1 25 5k 9 31k where...

Page 5: ...NCY www ti com Typical Performance Characteristics THD N vs Output Power THD N vs Output Power VDD 3 6V RL 8 VDD 3V RL 8 f 1kHz filter 22kHz PV1 7V f 1kHz filter 22kHz PV1 4 8V THD N vs Output Power T...

Page 6: ...0 0 0 OUTPUT POWER W EFFICIENCY 0 5 1 0 1 5 2 0 2 5 80 10 Typical Performance Characteristics www ti com Boost Amplifier vs Output Power Boost Amplifier vs Output Power VDD 5V RL 8 VDD 3 6V RL 8 f 1k...

Page 7: ...PECTRUM FIXED FREQUENCY 0 20 40 60 80 100 20 200 2k 20k PSRR dB FREQUENCY Hz FIXED FREQUENCY SPREAD SPECTRUM www ti com Typical Performance Characteristics PSRR vs Frequency PSRR vs Frequency VDD 3 6V...

Page 8: ...SSIPATION W 0 4 0 OUTPUT POWER W 0 2 0 4 0 6 0 8 1 0 1 2 1 4 1 6 0 5 1 0 1 5 2 0 2 5 3 0 3 5 1 8 0 Typical Performance Characteristics www ti com Power Dissipation vs Output Power Supply Current vs Su...

Page 9: ...LOAD CURRENT A EFFICIENCY 0 1 0 2 0 3 0 4 0 5 80 10 www ti com Typical Performance Characteristics Boost Converter Efficiency Boost Converter Efficiency vs vs ILOAD DC ILOAD DC VDD 5V PV1 7 8V VDD 3...

Page 10: ...e distance priority to the quiet ground 10 Bill Of Materials Designator Description Footprint Qty Value Cf1 CHIP CAPACITOR GENERIC CAP 0805 1 470pF CINA CHIP CAPACITOR GENERIC CAP 1210 1 1 F CINB CHIP...

Page 11: ...ion Board PCB Layout Figure 3 Top Silkscreen Figure 4 Top Layer 11 SNAA064C November 2008 Revised May 2013 AN 1922 LM48511 Evaluation Board Submit Documentation Feedback Copyright 2008 2013 Texas Inst...

Page 12: ...PCB Layout www ti com Figure 5 Mid Layer 1 Figure 6 Mid Layer 2 12 AN 1922 LM48511 Evaluation Board SNAA064C November 2008 Revised May 2013 Submit Documentation Feedback Copyright 2008 2013 Texas Inst...

Page 13: ...on Board PCB Layout Figure 7 Bottom Layer Figure 8 Bottom Overlay 13 SNAA064C November 2008 Revised May 2013 AN 1922 LM48511 Evaluation Board Submit Documentation Feedback Copyright 2008 2013 Texas In...

Page 14: ...the title of Table 1 from LME49600 to LM48511 Edited Table 1 Demonstration Board Connections Edited Figure 2 Typical LM48511 Audio 1 02 10 18 12 Amplifier Circuit 14 AN 1922 LM48511 Evaluation Board S...

Page 15: ...sponsible for compliance with all legal regulatory and safety related requirements concerning its products and any use of TI components in its applications notwithstanding any applications related inf...

Reviews: