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2
PCB Design
2.1
PCB Layout
PCB Design
This chapter presents the layout design of the PCB thereby describing the physical and mechanical
characteristics of the EVM. The list of components used on the module is also included in this section.
The AMC7823 EVM was designed using the double-wide modular EVM form factor developed by Texas
Instruments. This EVM form factor allows direct evaluation of the AMC7823 operating characteristics and
speeds up software development and other prototyping needs.
The AMC7823 EVM board is constructed on a four-layer printed circuit board using a copper-clad FR-4
laminate material. The printed circuit board has dimensions of 93,9800 mm (3.7000 inch)
×
81,2800 mm
(3.200 inch), and the board thickness is 1,5748 mm (0.0620 inch).
through
show the
individual artwork layers.
Figure 2. Top Silkscreen
AMC7823 Evaluation Module
4
SLAU171 – November 2005
