Texas Instruments ALM2402FQ1EVM, User Manual, Page: 7 / 19

10uF
C18
100nF
C19
10nF
50V
C8
C12
24.9k
R3
10.0k
R4
0
R9
VCC_2
GND
GND
100nF
C4
100nF
C5
50V
100nF
C10
GND GND
GND
VCC_S
VCC_1
R6
R2
C2 R1
GND
R5
C6
R7
C9
GND
24.9k
R17
10.0k
R16
0
R11
R14
R19
C21
R18
C20
GND
R15
C16
R13
C13
GND
R10
10nF
50V
C14
GND
GND
10.0k
R8
10.0k
R12
GND
VCC_S
100nF
C11
GND
VCC_1
VCC_S
VCC_2
10uF
C22
100nF
C23
10uF
C25
100nF
C26
GND
GND
GND
D1
MBRS2040LT3G
1
J1
1
J2
1
J4
1
J6
1
2
3
4
J3
1
2
3
4
5
6
J7
GND
1
2
3
J5
1
2
3
J10
1
2
3
J8
VCC_S
VCC_S
TP1
IN1-
TP2
IN1+
1
2
3
J9
GND
C24
GND
TP7
IN2+
TP10
IN2-
GND
GND
GND
GND
TP4
GND
GND
TP11
GND
GND
TP14
GND
GND
10.0k
R20
VCC_S
TP13
TP8
GND
GND
TP3
OUT1
TP6
OUT2
TP9
GND
GND
TP12
GND
GND
TP5
GND
GND
C1
ALM2402FQPWPRQ1
IN1-
1
IN1+
2
SH_DN/OTF
3
IN2+
4
IN2-
5
GND
6
NC
7
NC
8
OUT2
9
VS_O2
10
VS
11
VS_O1
12
OUT1
13
GND
14
A1
A2
Thermal
Shutdown
EN
EN
EN
GND
15
U1
150nF
50V
C3
150nF
50V
C7
150nF
50V
C15
150nF
50V
C17
DNP
DNP DNP DNP DNP
DNP DNP DNP
DNP
DNP
DNP
DNP
DNP
DNP
DNP
DNP
DNP
DNP
Note: DNP components are not populated.
DNP
DNP
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Schematic, PCB Layout, and Bill of Materials
7 SBOU227 – September 2019
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Copyright © 2019, Texas Instruments Incorporated
ALM2402F-Q1 Evaluation Module
7 Schematic, PCB Layout, and Bill of Materials
This section contains the schematic, bill of materials, and references for the ALM2402FQ1EVM.
7.1 Schematic
Figure 5 illustrates the EVM schematic.
Figure 5. ALM2402FQ1EVM Schematic
7.2 PCB Layout
The ALM2402FQ1EVM is a four-layer PCB design. Figure 6 to Figure 9 show the PCB layer illustrations.
The top layer consists of all signal path traces, and is poured with a solid ground plane. A symmetrical
board layout is used on amplifier 1 and amplifier 2 to keep good performance matching. Decoupling
capacitors C4, C5, and C10 are positioned on the top layer as close as possible to the power supply pins
of the device. The second internal layer is a dedicated solid GND plane. Independent vias are placed at
the ground connection of every component to provide a low-impedance path to ground. The third internal
layer and the bottom layer route the power-supply connections.