2 Technical Specification
XMC Interface
Mechanical Interface
Conduction Cooled Switched Mezzanine Card (CCXMC) Interface
conforming to ANSI/VITA 42.0-2008 (Auxiliary Standard)
Standard single-width (143.75mm x 74mm)
Electrical Interface
PCI Express (Base Specification 2.1) up to x8 compliant interface
conforming to ANSI/VITA 42.3-2006 (XMC PCI Express Protocol
Layer Standard)
On Board Devices
10 Gigabit Ethernet Controller
X540 (Intel)
IPMI resource FRU Data EEPROM
M24C02 (STMicroelectronics)
Ethernet Interface
Number of Interfaces
2
Link
100Base-TX / 1000Base-T / 10GBase-T
I/O Connector
XMC P16 back I/O (Samtec ASP-105885-01 or compatible)
Physical Data
Power Requirements
450mA typical @ VPWR = +12V DC (no link)
app. -40mA per 100Mbit/s link
app. additional 65mA per 1Gbit/s link
app. additional 300mA per 10Gbit/s link
1000mA typical @ VPWR = +5V DC (no link)
app. -80mA per 100Mbit/s link
app. additional 175mA per 1Gbit/s link
app. additional 800mA per 10Gbit/s link
1mA typical @ +3.3V DC
Temperature Range
Operating
Storage
-40°C to +85°C (Card Edge Temperature)
-40°C to +85°C
MTBF
592000 h
MTBF values shown are based on calculation according to MIL-HDBK-217F and
MIL-HDBK-217F Notice 2; Environment: G
B
20°C.
The MTBF calculation is based on component FIT rates provided by the
component suppliers. If FIT rates are not available, MIL-HDBK-217F and
MIL-HDBK-217F Notice 2 formulas are used for FIT rate calculation.
Humidity
5 – 95 % non-condensing
Weight
88 g
Table 2-1 : Technical Specification
TXMC387 User Manual Issue 1.0.0
Page 7 of 12
