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Telit Wireless Solutions LE910C1 Series, Hardware User'S Manual

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LE910C1

 Hardware User Guide 

1VV0301298   Rev. 1.08 - 2017-11-14 

Reproduction forbidden without written authorization by Telit Communications S.p.A. - All Rights Reserved 

Telit Confidential Information, provided under NDA              

 

Page 

78 of 119

 

8.5.

 

Peripheral Ports 

In addition to the LE910C1 serial ports, the LE910C1 supports the following peripheral ports: 

•

 

SPI – Serial Peripheral Interface 

•

 

I2C - Inter-integrated circuit 

•

 

SD/MMC Card Interface  

•

 

SDIO Interface  

8.5.1.

 

SPI – Serial Peripheral Interface 

The LE910C1 SPI supports the following: 

•

 

Master Mode only 

•

 

1.8V CMOS level 

•

 

Up to 50 MHz clock rate 

 

NOTE: 

SPI is supported only on the Linux side. 
The LE910C1 module supports Master mode only and cannot be configured as Slave mode. 

 

NOTE: 

Simultaneous / Concurrent usage of AUX UART and SPI is not supported. 

Table 27: SPI Signals 

PAD 

Signal 

I/O 

Function 

Type 

Comment 

F15 

SPI_CLK 

O 

SPI clock output 

1.8V 

 

E15 

SPI_MISO 

I 

SPI data Master input Slave output  1.8V 

Shared with RX_AUX 

D15 

SPI_MOSI 

O 

SPI data Master output Slave input  1.8V 

Shared with TX_AUX 

H14 

SPI_CS/GPIO11  O 

SPI chip-select output 

1.8V 

 

Figure 15: SPI Signal Connectivity 

 

 

 

LE910C1 

 

SPI_CS

 

SPI_CLK

 

SPI_MO

 

SPI_MISO

 

Host (Slave)

 

SPI_CS

 

SPI_CLK

 

SPI_MOSI

 

 SPI_MISO

 

Summary of Contents for LE910C1 Series

Page 1: ...LE910C1 Hardware User Guide 1VV0301298 Rev 1 08 2017 11 14 ...

Page 2: ...ions S p A All Rights Reserved Telit Confidential Information provided under NDA Page 2 of 119 Applicability Table This documentation applies to the following products Table 1 Applicability Table Module Name Description LE910C1 NA North America AT T with global roaming LE910C1 NS North America Sprint variant LE910C1 AP APAC variant ...

Page 3: ...er media Laws in Italy and other countries preserve for Telit and its licensors certain exclusive rights for copyrighted material including the exclusive right to copy reproduce in any form distribute and make derivative works of the copyrighted material Accordingly any copyrighted material of Telit and its licensors contained herein or in the Telit products described in this instruction manual ma...

Page 4: ...any language or computer language in any form or by any means without prior written permission of Telit High Risk Materials Components units or third party products used in the product described herein are NOT fault tolerant and are NOT designed manufactured or intended for use as on line control equipment in the following hazardous environments requiring fail safe controls the operation of nuclea...

Page 5: ...ion 17 2 1 Overview 17 2 2 Applications 17 2 3 General Functionality and Main Features 18 2 4 Block Diagram 21 2 5 Environmental Requirements 22 2 5 1 Temperature Range 22 2 5 2 RoHS Compliance 22 2 6 Frequency Bands 23 2 6 1 RF Bands per Regional Variant 23 2 6 2 Reference Table of RF Bands Characteristics 24 2 7 RF parameters 27 2 7 1 Sensitivity 27 2 7 2 Output power 27 2 8 LE910C1 Mechanical S...

Page 6: ...Card Pads 2 95V 47 4 3 7 SIM Card Pads 2 95V 48 5 Hardware Commands 49 5 1 Turning on the LE910C1 Module 49 5 2 Initialization and Activation State 49 5 3 Turning OFF the LE910C1 Module 52 5 3 1 Shutdown by Software Command 52 5 3 2 Hardware Shutdown 53 5 3 4 Unconditional Hardware Shutdown 54 6 Power Supply 55 6 1 Power Supply Requirements 55 6 2 General Design Rules 58 6 2 1 Electrical Design Gu...

Page 7: ...nna Installation Guidelines 69 8 Hardware Interfaces 70 8 1 USB Port 71 8 2 HSIC Interface 72 8 3 SGMII Interface optional 72 8 3 1 Ethernet Control interface 72 8 4 Serial Ports 73 8 4 1 Modem Serial Port 1 Signals 74 8 4 2 Modem Serial Port 2 75 8 4 3 RS232 Level Translation 76 8 5 Peripheral Ports 78 8 5 1 SPI Serial Peripheral Interface 78 8 5 2 I2C Inter integrated Circuit 79 8 5 3 SD MMC Car...

Page 8: ...he Temperature Monitor Function 94 9 7 GNSS Characteristics 95 10 Mounting the Module on your Board 96 10 1 General 96 10 2 Finishing Dimensions 96 10 3 Recommended Footprint for the Application 99 10 4 Stencil 100 10 5 PCB Pad Design 100 10 6 Recommendations for PCB Pad Dimensions mm 101 10 7 Solder Paste 102 10 7 1 Solder Reflow 102 11 Application Guide 104 11 1 Debug of the LE910C1 Module in Pr...

Page 9: ...thorization by Telit Communications S p A All Rights Reserved Telit Confidential Information provided under NDA Page 9 of 119 12 2 Tape Reel 111 12 3 Moisture Sensitivity 113 13 Safety Recommendations 114 14 Conformity assessment issues 115 14 1 FCC ISED Regulatory notices 115 15 Document History 118 ...

Page 10: ...r SIM Pads Operating at 2 95V 48 Table 16 Power Supply Requirements 55 Table 17 LE910C1 Current Consumption 55 Table 18 GSM WCDMA LTE Antenna Requirements 64 Table 19 Antenna Line on PCB Requirements 64 Table 20 Antenna Diversity Requirements 66 Table 21 Antenna Line on PCB Requirements 68 Table 22 LE910C1 Hardware Interfaces 70 Table 23 USB Interface Signals 71 Table 24 Ethernet Control Interface...

Page 11: ...2017 11 14 Reproduction forbidden without written authorization by Telit Communications S p A All Rights Reserved Telit Confidential Information provided under NDA Page 11 of 119 Table 41 EMC Recommendations 107 Table 42 Document Revision History 118 ...

Page 12: ...mple of Switching Regulator with 12V Input Part 2 60 Figure 13 RS232 Level Adaption Circuitry Example 76 Figure 14 RS232 Serial Port Lines Connection Layout 77 Figure 15 SPI Signal Connectivity 78 Figure 16 SD MMC Interface Connectivity 80 Figure 17 Primary PCM Timing 84 Figure 18 Auxiliary PCM Timing 86 Figure 19 GPIO Output Pad Equivalent Circuit 91 Figure 20 Status LED Reference Circuit 92 Figu...

Page 13: ... is suggested for each function and incorrect solutions and common errors to be avoided are pointed out Obviously this document cannot embrace every hardware solution or every product that can be designed Obviously avoiding invalid solutions must be considered mandatory Where the suggested hardware configurations need not be considered mandatory the information given should be used as a guide and ...

Page 14: ...hnical Support Center TTSC Our aim is to make this guide as helpful as possible Keep us informed of your comments and suggestions for improvements Telit appreciates feedback from the users about the information provided 1 4 Text Conventions The following conventions are used to emphasize specific types of information Danger This information MUST be followed or catastrophic equipment failure or bod...

Page 15: ... Document Number Ref 1 LE9x0 AT Command User Guide 80407ST10116A Ref 2 Telit EVB HW User Guide 1VV0301249 Ref 3 LE910C1 Interface Board HW User Guide 1VV0301323 Ref 4 LE910 LE920 Digital Voice Interface Application Note 80000NT11246A Ref 5 Telit_LE920A4_LE910C1_Wi Fi_Interface_Application_Note_r1 80490NT11511A Ref 6 Antenna Detection Application Note 80000NT10002A Ref 7 High Speed Inter Chip USB E...

Page 16: ...ation satellite system GNSS Global navigation satellite system GPIO General purpose input output GPRS General packet radio services GPS Global positioning system GSM Global system for mobile communications HSIC High speed inter chip I2C Inter integrated circuit LTE Long term evolution SD Secure digital SGMII Serial Gigabit media independent interface SIM Subscriber identity module SOC System on Ch...

Page 17: ...nd for telematics products offering GNSS and mobile communication features to an external host CPU through its rich interfaces LE910C1 is available in hardware variants as listed in Table 1 Applicability Table For differences in the designated RF band sets refer to Section 2 6 1 RF Bands per Regional Variant 2 2 Applications LE910C1 can be used for telematics applications where tamper resistance c...

Page 18: ...cation o LTE FDD Cat1 Other variants 10 5Mbps DL UL o Carrier aggregation is not supported o GSM GPRS EDGE o WCDMA up to DC HSPA Rel 9 Support for SIM profile switching Regional variants with optimal choice of RF bands for worldwide coverage of countries and MNOs State of the art GNSS solution with GPS GLONASS BeiDou Galileo QZSS receiver Digital audio subsystem PCM I2S digital audio interface Up ...

Page 19: ...EEE1588 PTP Precision Time Protocol USB2 0 USB port is typically used for o Flashing of firmware and module configuration o Production testing o Accessing the Application Processor s file system o AT command access o High speed WWAN access to external host o Diagnostic monitoring and debugging o Communication between Java application environment and an external host CPU o NMEA data to an external ...

Page 20: ...alified by Telit for satisfying the environment and quality requirements Single supply module The module generates all its internal supply voltages RTC No dedicated RTC supply RTC is supplied by VBATT Operating temperature Range 40 C to 85 C conditions as defined in Section 2 5 1 Temperature Range NOTE The following interfaces are unique for the LE910C1 and may not be supported on other former or ...

Page 21: ...e functions are contained in a single SOC RF front end including antenna diagnosis circuitry Analog Audio codec for attaching external speaker amplifier and microphone Rich IO interfaces Depending on which LE910C1 software features are enabled some of its interfaces that are exported due to multiplexing may be used internally and thus may not be usable by the application PMIC with the RTC function...

Page 22: ...lity within this range as well However there may possibly be some performance deviations in this extended range relative to 3GPP requirements which means that some RF parameters may deviate from the 3GPP specification in the order of a few dB For example receiver sensitivity or maximum output power may be slightly degraded Even so all the functionalities such as call connection SMS USB communicati...

Page 23: ... Bands The operating frequencies in GSM850 EGSM900 DCS1800 PCS1900 WCDMA LTE modes conform to the 3GPP specifications 2 6 1 RF Bands per Regional Variant Table 3 summarizes all region variants within the LE910C1 family showing the supported band sets in each variant Table 3 RF Bands per Regional Variant Region Variant LTE FDD LTE TDD HSPA TD SCDMA 2G LE910C1 NA 2 4 12 1 2 4 5 8 2 3 5 8 LE910C1 NS ...

Page 24: ...93 8 128 251 45 MHz EGSM 900 890 915 935 960 0 124 45 MHz 880 890 925 935 975 1023 45 MHz WCDMA 2100 B1 1920 1980 2110 2170 Tx 9612 9888 Rx 10562 10838 190 MHz WCDMA 1900 B2 1850 1910 1930 1990 Tx 9262 9538 Rx 9662 9938 80 MHz WCDMA 1800 B3 1710 1785 1805 1880 Tx 937 1288 Rx 1162 1513 95 MHz WCDMA AWS B4 1710 1755 2110 2155 Tx 1312 1513 Rx 1537 1738 400 MHz WCDMA 850 B5 824 849 869 894 Tx 4132 423...

Page 25: ...99 80 MHz LTE 1800 B3 1710 1785 1805 1880 Tx 19200 19949 Rx 1200 1949 95 MHz LTE AWS B4 1710 1755 2110 2155 Tx 19950 20399 Rx 1950 2399 400 MHz LTE 850 B5 824 849 869 894 Tx 20400 20649 Rx 2400 2649 45 MHz LTE 2600 B7 2500 2570 2620 2690 Tx 20750 21449 Rx 2750 3449 120 MHz LTE 900 B8 880 915 925 960 Tx 21450 21799 Rx 3450 3799 45 MHz LTE 1800 B9 1749 9 1784 9 1844 9 1879 9 Tx 21800 2149 Rx 3800 41...

Page 26: ...9 Rx 6150 6449 41 MHz LTE 1500 B21 1447 9 1462 9 1495 9 1510 9 Tx 24450 24599 Rx 6450 6599 48 MHz LTE 1900 B25 1930 1995 1850 1915 Tx 26040 26689 Rx 8040 8689 80 MHz LTE 850 B26 814 849 859 894 Tx 26690 27039 Rx 8690 9039 45 MHz LTE 700 B28 703 748 758 803 Tx 27210 27659 Rx 9210 9659 45 MHz LTE TDD 2600 B38 2570 2620 2570 2620 Tx 37750 38250 Rx 37750 38250 0 MHz LTE TDD 1900 B39 1880 1920 1880 192...

Page 27: ...ights Reserved Telit Confidential Information provided under NDA Page 27 of 119 2 7 RF parameters 2 7 1 Sensitivity LE910C1 typical sensitivity levels are as follow 108 dBm 2G 113 5 dBm 3G 103 dBm 4G FDD BW 5 MHz 2 7 2 Output power LE910Cx typical values for Max output level are as follow 2G LB 33dBm HB 30dBm 3G TD SCDMA 24dBm 4G FDD TDD 23dBm 1RB ...

Page 28: ...tion provided under NDA Page 28 of 119 2 8 LE910C1 Mechanical Specifications 2 8 1 Dimensions The LE910C1 module s overall dimensions are Length 28 2 mm 0 15 mm Tolerance Width 28 2 mm 0 15 mm Tolerance Thickness 2 2 mm 0 22 mm Tolerance NOTE Consider a typical label thickness of 0 1 mm in addition to the module thickness 2 8 2 Weight The nominal weight of the LE910C1 module is 9 0 gram ...

Page 29: ...er sense for the internal USB transceiver Power A14 USB_ID AI USB ID See note below Asynchronous UART N15 C103 TXD I Serial data input TXD from DTE 1 8V M15 C104 RXD O Serial data output to DTE 1 8V L14 C105 RTS I Input for Request to send signal RTS from DTE 1 8V P15 C106 CTS O Output for Clear to send signal CTS to DTE 1 8V P14 C107 DSR O Output for Data Set Ready DSR to DTE 1 8V Alternate Fn GP...

Page 30: ... RX_AUX 1 8V D15 SPI_MOSI TX_AUX O SPI data Master Output Slave input TX_AUX 1 8V H14 SPI_CS GPIO11 O SPI Chip select output GPIO11 1 8V See note below SD MMC Card Digital I O J12 SD MMC_CMD O SD Command 1 8 2 95V F12 SD MMC_CLK O SD Card Clock 1 8 2 95V E12 SD MMC_DATA0 I O SD Serial Data 0 1 8 2 95V G12 SD MMC_DATA1 I O SD Serial Data 1 1 8 2 95V K12 SD MMC_DATA2 I O SD Serial Data 2 1 8 2 95V H...

Page 31: ...13 WiFi_SD_DATA3 I O Wi Fi SD Serial Data 3 1 8V L12 WiFi_SDRST O Wi Fi Reset Power enable control 1 8V Active Low M11 WLAN_SLEEP_CLK O Wi Fi Sleep clock output 1 8V M10 RFCLK2_QCA O Wi Fi low noise RF clock output 1 8V LTE WiFi Coexistence M8 WCI_TX O Wireless coexistence interface TXD 1 8V M9 WCI_RX I Wireless coexistence interface RXD 1 8V SIM Card Interface 1 A6 SIMCLK1 O External SIM 1 signal...

Page 32: ...e DVI B9 DVI_WAO O Digital Voice interface WAO master output 1 8V B6 DVI_RX I Digital Voice interface Rx 1 8V B7 DVI_TX O Digital Voice interface Tx 1 8V B8 DVI_CLK O Digital Voice interface CLK master output 1 8V B12 REF_CLK O Reference clock for external Codec 1 8V See Note below General Purpose Digital I O C8 GPIO_01 I O GPIO_01 STAT_LED 1 8V Alternate Fn I2C C9 GPIO_02 I O GPIO_02 1 8V Alterna...

Page 33: ...ckoning 1 8V Miscellaneous Functions R12 ON_OFF_N I Power ON Power OFF input Active low R13 HW_SHUTDOWN_N I Unconditional Shutdown input Active low R11 VAUX PWRMON O Supply output for external accessories Power ON monitor 1 8V B1 ADC_IN1 AI Analog Digital Converter Input 1 Analog H4 ADC_IN2 AI Analog Digital Converter Input 2 Analog D7 ADC_IN3 AI Analog Digital Converter Input 3 Analog SGMII Inter...

Page 34: ... Data 1 8V Internally PU 2 2kΩ to 1 8V Power Supply M1 VBATT Main Power Supply Digital Section Power M2 VBATT Main Power Supply Digital Section Power N1 VBATT_PA Main Power Supply RF Section Power N2 VBATT_PA Main Power Supply RF Section Power P1 VBATT_PA Main Power Supply RF Section Power P2 VBATT_PA Main Power Supply RF Section Power A2 GND Ground B13 GND Ground D4 GND Ground E1 GND Ground E2 GN...

Page 35: ...Information provided under NDA Page 35 of 119 H2 GND Ground H7 GND Ground H8 GND Ground H9 GND Ground J1 GND Ground J2 GND Ground J7 GND Ground J8 GND Ground J9 GND Ground K2 GND Ground L1 GND Ground L2 GND Ground M3 GND Ground M4 GND Ground M12 GND Ground N3 GND Ground N4 GND Ground N5 GND Ground N6 GND Ground P3 GND Ground P4 GND Ground P5 GND Ground P6 GND Ground P8 GND Ground ...

Page 36: ... GND Ground P10 GND Ground P13 GND Ground R2 GND Ground R3 GND Ground R5 GND Ground R6 GND Ground R8 GND Ground R10 GND Ground Reserved A8 Reserved Reserved A9 Reserved Reserved A10 Reserved Reserved B2 Reserved Reserved B3 Reserved Reserved B4 Reserved Reserved B5 Reserved Reserved C3 Reserved Reserved C4 Reserved Reserved C5 Reserved Reserved C6 Reserved Reserved C7 Reserved Reserved C14 Reserve...

Page 37: ...10 Reserved Reserved D11 Reserved Reserved D12 Reserved Reserved D13 Reserved Reserved D14 Reserved Reserved E3 Reserved Reserved E13 Reserved Reserved F3 Reserved Reserved F14 Reserved Reserved G3 Reserved Reserved G14 Reserved Reserved H3 Reserved Reserved H15 Reserved Reserved J3 Reserved Reserved J4 Reserved Reserved J14 Reserved Reserved J15 Reserved Reserved K3 Reserved Reserved K4 Reserved ...

Page 38: ... Information provided under NDA Page 38 of 119 M5 Reserved Reserved M6 Reserved Reserved M7 Reserved Reserved N7 Reserved Reserved N8 Reserved Reserved N10 Reserved Reserved N11 Reserved Reserved N12 Reserved Reserved P7 Reserved Reserved P11 Reserved Reserved P12 Reserved Reserved Reserved for future use R4 RFU Reserved for future use Not connected internally Can be tied to GND ...

Page 39: ... during the boot NOTE When the UART signals are used as the communication port between the Host and the Modem RTS must be connected to GND on the module side if flow control is not used If the UART port is not used UART signals can be left floating NOTE Unless otherwise specified RESERVED pins must be left unconnected Floating NOTE The following pins are unique for the LE910C1 and may not be suppo...

Page 40: ... J8 J9 K2 L1 L2 M3 M4 M12 N3 N4 N5 N6 P3 P4 P5 P6 P8 P9 P10 P13 R2 R3 R5 R6 R8 R10 GND R12 ON OFF Main power on off signal R13 HW_SHUTDOWN_N Emergency power off B15 USB_D If not used connect to a Test Point or an USB connector C15 USB_D If not used connect to a Test Point or an USB connector A13 USB_VBUS If not used connect to a Test Point or an USB connector N15 C103 TXD If not used connect to a ...

Page 41: ...mmunications S p A All Rights Reserved Telit Confidential Information provided under NDA Page 41 of 119 PAD Signal Notes R9 ANT_GPS GPS antenna C4 C5 C6 C7 D3 E3 G3 K4 L4 P11 Reserved Connect to a Test Point for Telit internal use L15 GPIO_09 If not used connect to a Test Point M9 WCI_RX If not used connect to a Test Point ...

Page 42: ...MII_TX_P RES GND GND GND 6 SIMCLK DVI_RX RES SGMII_TX_M RES GND GND GND 7 SIMRST DVI_TX RES ADC_IN3 GND GND GND RES RES RES GPS_LNA_EN 8 RES DVI_CLK GPIO_01 RES GND GND GND WCI_TXD_TGPIO24 RES GND GND 9 RES DVI_WA0 GPIO_02 RES GND GND GND WCI_RXD_TGPIO25 GPS_SYNC GND ANT_GPS 10 RES I2C_SDA GPIO_03 RES RFCLK2_QCA RES GND GND 11 HSIC_STB I2C_SCL GPIO_04 RES WLAN_SLEEP_CLK RES RES VAUX PWRMON 12 HSIC...

Page 43: ...ompatible to the previous xE910 in terms of Mechanical dimensions Package and pin map To support the extra features and additional interfaces the LE910C1 introduces more pins compared to the xE910 The extra pins of the LE910C1 can be considered as optional if not needed and can be left unconnected floating if not used In this case the new LE910C1 can be safely mounted on existing carrier boards de...

Page 44: ...mum Ratings Not Operational Symbol Parameter Min Max Unit VBATT Battery supply voltage on pin VBATT 0 5 6 0 V VBATT TRANSIENT Transient voltage on pin VBATT 10 ms 0 5 7 0 V VBATT_PA Battery supply voltage on pin VBATT_PA 0 3 6 0 V 4 2 Recommended Operating Conditions Table 8 Recommended Operating Conditions Symbol Parameter Min Typ Max Unit Tamb Ambient temperature 40 25 85 C VBATT Battery supply ...

Page 45: ...throughout all drive strengths and the entire temperature ranges NOTE Do not connect LE910C1 s digital logic signal directly to OEM s digital logic signal with a level higher than 2 7V for 1 8V CMOS signals 4 3 1 1 8V Pads Absolute Maximum Ratings Table 9 Absolute Maximum Ratings Not Functional Parameter Min Max Input level on any digital pin when on 0 3V 2 16V Input voltage on analog pins when on...

Page 46: ...KΩ to 50KΩ 4 3 3 1 8V SD Card Pads Table 11 Operating Range SD Card Pads Working at 1 8V Pad Parameter Min Max Unit Comment VIH Input high level 1 27V 2V V VIL Input low level 0 3V 0 58V V VOH Output high level 1 4V V VOL Output low level 0 0 45V V IIL Low level input leakage current 2 uA No pull up IIH High level input leakage current 2 uA No pull down RPU Pull up resistance 10 100 kΩ RPD Pull do...

Page 47: ...istance 10 100 kΩ Ci Input capacitance 5 pF 4 3 5 Dual Voltage Pads Absolute Maximum Ratings Table 13 Absolute Maximum Ratings Not Functional Parameter Min Max Input level on any digital pin when on 0 3V 3 6V Input voltage on analog pins when on 0 3V 3 6 V 4 3 6 SD Card Pads 2 95V Table 14 Operating Range For SD Card Pads Operating at 2 95V Pad Parameter Min Max Unit Comments VIH Input high level ...

Page 48: ... 10 100 kΩ Ci Input capacitance 5 pF 4 3 7 SIM Card Pads 2 95V Table 15 Operating Range For SIM Pads Operating at 2 95V Pad Parameter Min Max Unit Comment VIH Input high level 2 1V 3 1V V VIL Input low level 0 3V 0 55V V VOH Output high level 2 25V 3 1V V VOL Output low level 0V 0 4V V IIL Low level input leakage current 10 uA No pull up IIH High level input leakage current 10 uA No pull down RPU ...

Page 49: ...circuit to power on the module using an inverted buffer output Figure 4 Power on Circuit NOTE Recommended values R2 47kΩ R1 10kΩ 5 2 Initialization and Activation State After turning on the LE910C1 module the LE910C1 is not yet activated because the SW initialization process of the LE910C1 module is still in process internally It takes some time to fully complete the HW and SW initialization of th...

Page 50: ... to their desired mode When PWRMON goes high this indicates that the initialization of all I O pads is completed NOTE Do not use any pull up resistor on the ON OFF line as it is internally pulled up Using a pull up resistor may cause latch up problems on the LE910C1 power regulator and improper powering on off of the module The ON OFF line must be connected only in an open collector configuration ...

Page 51: ...ights Reserved Telit Confidential Information provided under NDA Page 51 of 119 NOTE Active low signals are labeled with a name that ends with or with _N NOTE To avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the module when it is powered OFF or during an ON OFF transition ...

Page 52: ...itor the PWRMON hardware line When PWRMON goes low this indicates that the device has powered off NOTE To avoid a back powering effect it is recommended to avoid having any HIGH logic level signal applied to the digital pins of the module when it is powered OFF or during an ON OFF transition 5 3 1 Shutdown by Software Command The LE910C1 module can be shut down by a software command When a shutdow...

Page 53: ...seconds and then released Use the same circuitry and timing for power on When the hold time of ON OFF is above 2 5 seconds LE910C1 goes into the Finalization state and in the end shuts down PWRMON The duration of the Finalization state can differ according to the current situation of the module so a value cannot be defined Usually it will take more than 15 seconds from sending a shutdown command u...

Page 54: ...m power down timing for using HW_SHUTDOWN_N is shown below Figure 9 Power down timing using HW_SHUTDOWN_N NOTE Recommended values R2 47kΩ R1 10kΩ NOTE Do not use any pull up resistor on the HW_SHUTDOWN_N line or any totem pole digital output Using a pull up resistor may cause latch up problems on the LE910C1 power regulator and improper functioning of the module The HW_SHUTDOWN_N line must be conn...

Page 55: ...ply Requirements Nominal supply voltage 3 8V Supply voltage range 3 4V 4 2V Max ripple on module input supply 30mV NOTE For PTCRB approval on the final products the power supply is required to be within the range of Normal Supply voltage ranger Table 17 provides typical current consumption values of LE910C1 for various operation modes Table 17 LE910C1 Current Consumption Mode Average Typical Mode ...

Page 56: ...a call Cat 14 Tx 0 dBm Max throughput WCDMA HSDPA 22 dBm 310mA WCDMA data call Cat 14 Tx 22 dBm Max throughput 5 Operative Mode GSM GSM Tx and Rx mode GSM900 PL5 250mA GSM voice call DCS1800 PL0 170mA GPRS 4 Tx 1 Rx GSM900 PL5 430mA GPRS Sending Data mode CS 4 DCS1800 PL0 340mA 6 Operative Mode GPS GPS tracking 40mA LTE connection is idle Worst best case current values depend on network configurat...

Page 57: ...ential Information provided under NDA Page 57 of 119 If the layout of the PCB is not well designed a strong noise floor is generated on the ground This will reflect on all the audio paths producing an audible annoying noise at 216 Hz If the voltage drops during the peaks current absorption is too high The device may even shut down as a consequence of the supply voltage drop ...

Page 58: ... Battery 6 2 1 1 5V Input Source Power Supply Design Guidelines The desired output for the power supply is 3 8V So the difference between the input source and the desired output is not big and therefore a linear regulator can be used A switching power supply is preferred to reduce power consumption When using a linear regulator a proper heat sink must be provided to dissipate the power generated A...

Page 59: ...ransient response This allows the regulator to respond quickly to the current peaks absorption In any case the selection of the frequency and switching design is related to the application to be developed due to the fact that the switching frequency can also generate EMC interference For car batteries lead acid accumulators the input voltage can rise up to 15 8V This must be kept in mind when choo...

Page 60: ... Telit Communications S p A All Rights Reserved Telit Confidential Information provided under NDA Page 60 of 119 Figure 11 and Figure 12 show an example of switching regulator with 12V input Figure 11 Example of Switching Regulator with 12V Input Part 1 Figure 12 Example of Switching Regulator with 12V Input Part 2 ...

Page 61: ...ery types directly connected to the LE910C1 module Their use can lead to overvoltage on the LE910C1 and damage it Use only Li Ion battery types A bypass low ESR capacitor of adequate capacity must be provided to cut the current absorption peaks a 100μF tantalum capacitor is usually suitable on both VBATT and VBATT_PA together Make sure that the low ESR capacitor usually a tantalum one is rated at ...

Page 62: ...s of LTE HSPA GPRS plus average consumption in GPS Tracking mode Considering the very low current during Idle especially if the Power Saving function is enabled it is possible to consider from the thermal point of view that the device absorbs significant current only during an Active Call or Data session For the heat generated by the LE910C1 module consider it to be 2W max during transmission at C...

Page 63: ... voltage drops on the power line at the current peaks frequency of 216 Hz that will reflect on all the components connected to that supply also introducing the noise floor at the burst base frequency For this reason while a voltage drop of 300 400 mV may be acceptable from the power loss point of view the same voltage drop may not be acceptable from the noise point of view If your application does...

Page 64: ...bands provided by the network operator and also supported by the car OEM while using the Telit module The bands supported by each variant of the LE910C1 module family are provided in Section 2 6 1 RF Bands per Regional Variant Gain Gain 3 dBi Impedance 50 Ohm Input power 33 dBm 2 W peak power in GSM 24 dBm average power in WCDMA LTE VSWR absolute max 10 1 VSWR recommended 2 1 Since there is no ant...

Page 65: ... since the antenna line loss should be less than around 0 3 dB Line geometry should have uniform characteristics constant cross sections and avoid meanders and abrupt curves Any suitable geometry structure can be used for implementing the printed transmission line affecting the antenna If a ground plane is required in the line geometry this plane must be continuous and sufficiently extended so the...

Page 66: ...unction is called Antenna Diversity Table 20 Antenna Diversity Requirements Frequency range The customer must use the most suitable antenna band width for covering the frequency bands provided by the network operator and also supported by the car OEM while using the Telit module The bands supported by each variant of the LE910C1 module family are provided in Section 2 6 1 RF Bands per Regional Var...

Page 67: ...n to prevent damage to the LE910C1 module due to unwanted DC voltage NOTE It is recommended to add PI matching network near the GPS connector on the application board in case that RF matching is needed 7 5 1 Combined GNSS Antenna The use of a combined RF GNSS antenna is NOT recommended This solution can generate an extremely poor GNSS reception In addition the combination of antennas requires an a...

Page 68: ...duce the loss The antenna line must have uniform characteristics constant cross section avoiding meanders and abrupt curves Keep one layer of the PCB used only for the Ground plane if possible Surround on the sides over and under the antenna line on the PCB with Ground Avoid having other signal tracks directly facing the antenna line track The Ground around the antenna line on the PCB must be stri...

Page 69: ...stallation Guidelines The LE910C1 due to its sensitivity characteristics is capable of performing a fix inside buildings In any case the sensitivity could be affected by the building characteristics i e shielding The antenna must not be co located or operating in conjunction with any other antenna or transmitter The antenna must not be installed inside metal cases The antenna must be installed acc...

Page 70: ...of the LE910C1 module Table 22 LE910C1 Hardware Interfaces Interface LE910C1 SGMII For Ethernet support HSIC x1 SD MMC x1 dual voltage interface for supporting SD MMC card SDIO For WIFI support 1 8V only USB USB2 0 Optional OTG support SPI Master only up to 50 MHz I2C For sensors audio control UART 2 HS UART up to 4 Mbps Audio I F I2S PCM Analog I O GPIO 10 27 10 dedicated 17 multiplexed with othe...

Page 71: ...he USB interface signals Table 23 USB Interface Signals Signal Pad No Usage USB_VBUS A13 Power and cable detection for the internal USB transceiver Acceptable input voltage range 2 5V 5 5V max 5 mA consumption USB_D C15 Minus line of the differential bi directional USB signal to from the peripheral device USB_D B15 Plus line of the differential bi directional USB signal to from the peripheral devi...

Page 72: ...ng the following key features The SGMII interface can be used connect to an external Ethernet PHY or an external switch When enabled an additional network interface will be available to the Linux kernel s router 8 3 1 Ethernet Control interface When using an external PHY for Ethernet connectivity the LE910C1 also includes the control interface for managing the external PHY The table below lists th...

Page 73: ... PORT 1 Main MODEM SERIAL PORT 2 Auxiliary Several configurations can be designed for the serial port on the OEM hardware The most common are RS232 PC com port Microcontroller UART 1 8V Universal Asynchronous Receive Transmit Microcontroller UART 3 3V 5V or other voltages different from 1 8V Depending on the type of serial port on the OEM hardware a level translator circuit may be needed to make t...

Page 74: ... the LE910C1 UART 3 TXD RX_UART N15 Receive line see Note Input receive line of the LE910C1 UART 4 DTR DTR_UART M14 Data Terminal Ready Input to LE910C1 that controls the DTE READY condition 5 GND A2 B13 D4 Ground Ground 6 DSR DSR_UART P14 Data Set Ready Output from the LE910C1 that indicates that the module is ready 7 RTS RTS_UART L14 Request to Send Input to LE910C1 controlling the Hardware flow...

Page 75: ...n order not to prevent the UART and the entire module from entering low power mode DTR can be left floating if not used 8 4 2 Modem Serial Port 2 Serial Port 2 on the LE910C1 is a 1 8V UART with RX and TX signals only The UART functionality is shared with SPI thus simultaneous of SPI and UART is not supported The below table lists the signals of LE910C1 Serial Port 2 Table 26 Modem Serial Port 2 S...

Page 76: ...te the levels and invert the signal is by using a single chip level translator There are a multitude of them differing in the number of drivers and receivers and in the levels be sure to get a true RS232 level translator not a RS485 or other standards By convention the driver is the level translator from the 0 1 8V UART to the RS232 level The receiver is the translator from the RS232 level to 0 1 ...

Page 77: ...vided under NDA Page 77 of 119 NOTE In this case the length of the lines on the application must be taken into account to avoid problems in the case of High speed rates on RS232 The RS232 serial port lines are usually connected to a DB9 connector as shown in Figure 14 Signal names and directions are named and defined from the DTE point of view Figure 14 RS232 Serial Port Lines Connection Layout ...

Page 78: ...PI supports the following Master Mode only 1 8V CMOS level Up to 50 MHz clock rate NOTE SPI is supported only on the Linux side The LE910C1 module supports Master mode only and cannot be configured as Slave mode NOTE Simultaneous Concurrent usage of AUX UART and SPI is not supported Table 27 SPI Signals PAD Signal I O Function Type Comment F15 SPI_CLK O SPI clock output 1 8V E15 SPI_MISO I SPI dat...

Page 79: ... Master Mode only NOTE SW emulated I2C on GPIO lines is supported only from the Modem side For more information refer to the LE910C1 AT SW manual for command settings NOTE For keeping backward compatibility with previous LE910 products it is recommended to keep using the SW emulated I2C available on GPIO s 1 10 8 5 3 SD MMC Card Interface The LE910C1 provides an SD port supporting the SD3 0 specif...

Page 80: ...erial Data 0 1 8 2 95V G12 SD MMC_DATA1 I O SD Serial Data 1 1 8 2 95V K12 SD MMC_DATA2 I O SD Serial Data 2 1 8 2 95V H12 SD MMC_DATA3 I O SD Serial Data 3 1 8 2 95V G13 SD MMC_CD I SD card detect input 1 8V Active Low F13 VMMC Power supply for MMC card pull up resistors 1 8 2 95V Max Current is 50mA Figure 16 shows the recommended connection diagram of the SD interface Figure 16 SD MMC Interface...

Page 81: ...terface with a WiFi chipset Qualcomm QCA6574 chipset or other WiFi solutions The LE910C1 module includes an integrated SW driver for supporting the Qualcomm QCA6574 chipset The LE910C1 SDIO port supports the SDIO 3 0 specification at 1 8V CMOS only thus cannot be used as an external SD MMC card connection The LE910C1 module supports an LTE WiFi coexistence mechanism via the WCI Wireless Coexistenc...

Page 82: ...out written authorization by Telit Communications S p A All Rights Reserved Telit Confidential Information provided under NDA Page 82 of 119 NOTE It is recommended that WiFi_SDRST be equipped with a pull up resistor to 1 8V on the host application to disable WiFi reset function if needed ...

Page 83: ...nterface RX B PD 1 8V PCM_DIN B7 DVI_TX O Digital Audio Interface TX B PD 1 8V PCM_DOUT B8 DVI_CLK O Digital Audio Interface CLK B PD 1 8V PCM_CLK B12 REF_CLK O Audio Master Clock B PD 1 8V I2S_MCLK LE910C1 DVI has the following characteristics PCM Master mode using short or long frame sync modes 16 bit linear PCM format PCM clock rates of 256 kHz 512 kHz 1024 kHz and 2048 kHz Default Frame size o...

Page 84: ...08 2017 11 14 Reproduction forbidden without written authorization by Telit Communications S p A All Rights Reserved Telit Confidential Information provided under NDA Page 84 of 119 8 6 1 1 Short Frame Timing Diagrams Figure 17 Primary PCM Timing ...

Page 85: ...0301298 Rev 1 08 2017 11 14 Reproduction forbidden without written authorization by Telit Communications S p A All Rights Reserved Telit Confidential Information provided under NDA Page 85 of 119 Table 31 PCM_CODEC Timing Parameters ...

Page 86: ...08 2017 11 14 Reproduction forbidden without written authorization by Telit Communications S p A All Rights Reserved Telit Confidential Information provided under NDA Page 86 of 119 8 6 1 2 Long Frame Timing Diagrams Figure 18 Auxiliary PCM Timing ...

Page 87: ...01298 Rev 1 08 2017 11 14 Reproduction forbidden without written authorization by Telit Communications S p A All Rights Reserved Telit Confidential Information provided under NDA Page 87 of 119 Table 32 AUX_PCM_CODEC Timing Parameters ...

Page 88: ...rnate function pad is internally controlled by LE910C1 firmware and acts depending on the implemented function The following GPIOs are always available as a primary function on the LE910C1 Table 33 Primary GPIOs PAD Signal I O Function Type Drive Strength C8 GPIO_01 I O Configurable GPIO CMOS 1 8V 2 16 mA C9 GPIO_02 I O Configurable GPIO CMOS 1 8V 2 16 mA C10 GPIO_03 I O Configurable GPIO CMOS 1 8...

Page 89: ... 1 8V 2 16 mA L13 GPIO_19 I O WIFI_SDIO_CLK Configurable GPIO CMOS 1 8V 2 16 mA M8 GPIO_24 I O WCI_TXD Configurable GPIO CMOS 1 8V 2 16 mA M9 GPIO_25 I O WCI_RXD Configurable GPIO CMOS 1 8V 2 16 mA R14 GPIO_31 I O UART_RI Configurable GPIO CMOS 1 8V 2 16 mA P14 GPIO_32 I O UART_DSR Configurable GPIO CMOS 1 8V 2 16 mA N14 GPIO_33 I O UART_DCD Configurable GPIO CMOS 1 8V 2 16 mA M14 GPIO_34 I O UART...

Page 90: ...he pad has interface levels different from the 1 8V CMOS It can be buffered with an open collector transistor with a 47 kΩ pull up resistor to 1 8V 8 7 2 Using a GPIO Pad as an interrupt Wakeup source GPIO pads which are used as input can also be used as an interrupt source for the software In general all GPIO pads can be also used as interrupts However not all GPIO s can be used as a wakeup sourc...

Page 91: ...298 Rev 1 08 2017 11 14 Reproduction forbidden without written authorization by Telit Communications S p A All Rights Reserved Telit Confidential Information provided under NDA Page 91 of 119 Figure 19 GPIO Output Pad Equivalent Circuit ...

Page 92: ...E910C1 modules the STAT_LED usually needs an external transistor to drive an external LED The STAT_LED does not have a dedicated pin The STAT_LED functionality is available on GPIO_01 pin by default GPIO_01 functions as STAT_LED The table below shows the device status corresponding to the pin status Table 34 Network Service Availability Indication LED Status Device Status Permanently off Device of...

Page 93: ...vailable on GPIO_08 pin by default GPIO_08 functions as SW_RDY 9 3 RTC Real Time Clock The RTC within the LE910C1 module does not have a dedicated RTC supply pin The RTC block is supplied by the VBATT supply If the battery is removed RTC is not maintained so if maintaining an internal RTC is needed VBATT must be supplied continuously In Power OFF mode the average current consumption is 25uA 9 4 VA...

Page 94: ...Table 36 shows the ADC characteristics Table 36 ADC Parameters Min Max Units Input voltage range 0 1 1 7 Volt AD conversion 8 bits Resolution 6 6 mV 9 5 2 Using the ADC Converter An AT command is available to use the ADC function The command is AT ADC 1 2 The read value is expressed in mV Refer to LE9x0 AT Command User Guide 0 for the full description of this function 9 6 Using the Temperature Mon...

Page 95: ...stics and expected performance The values are related to typical environment and conditions Table 37 GNSS Characteristics Parameters Typical Measurement Notes Sensitivity Standalone or MS Based Tracking Sensitivity 162 3 dBm Acquisition 162 3 dBm Cold Start Sensitivity 157 5 dBm TTFF Hot 1 1s GPS GLONASS Simulator test Warm 22 1s GPS GLONASS Simulator test Cold 29 94s GPS GLONASS Simulator test Ac...

Page 96: ...rovided under NDA Page 96 of 119 10 Mounting the Module on your Board 10 1 General The LE910C1 module was designed to be compliant with a standard lead free SMT process 10 2 Finishing Dimensions Figure 21 shows the mechanical dimensions of the LE910C1 module Figure 21 LE910C1 Mechanical Dimensions bottom view Lead free Alloy Surface finishing Ni Au for all solder pads 4 x Route Inhibit Pin B1 ...

Page 97: ...8 Rev 1 08 2017 11 14 Reproduction forbidden without written authorization by Telit Communications S p A All Rights Reserved Telit Confidential Information provided under NDA Page 97 of 119 Figure 22 LE910C1 Mechanical Dimensions Top view ...

Page 98: ...8 Rev 1 08 2017 11 14 Reproduction forbidden without written authorization by Telit Communications S p A All Rights Reserved Telit Confidential Information provided under NDA Page 98 of 119 Figure 23 LE910C1 Mechanical Dimensions Side view ...

Page 99: ...imensions are in mm To facilitate replacing the LE910C1 module if necessary it is suggested to design the application with a 1 5 mm placement inhibit area around the module It is also suggested as a common rule for an SMT component to avoid having a mechanical part of the application in direct contact with the module NOTE In the customer application the region marked as INHIBIT in Figure 24 must b...

Page 100: ...erved Telit Confidential Information provided under NDA Page 100 of 119 10 4 Stencil Stencil s apertures layout can be the same as the recommended footprint 1 1 The suggested thickness of stencil foil is greater than 120 µm 10 5 PCB Pad Design The solder pads on the PCB are recommended to be of the Non Solder Mask Defined NSMD type Figure 25 PCB Pad Design ...

Page 101: ...5 mm unless it carries the same signal as the pad itself Micro via inside the pads are allowed Holes in pad are allowed only for blind holes and not for through holes Table 38 Recommendations for PCB Pad Surfaces Finish Layer Thickness um Properties Electro less Ni Immersion Au 3 7 0 05 0 15 Good solder ability protection high shear force values The PCB must be able to resist the higher temperatur...

Page 102: ...munications S p A All Rights Reserved Telit Confidential Information provided under NDA Page 102 of 119 10 7 Solder Paste We recommend using only no clean solder paste to avoid the cleaning of the modules after assembly 10 7 1 Solder Reflow Figure 27 shows the recommended solder reflow profile Figure 27 Solder Reflow Profile ...

Page 103: ... C second max Preheat Temperature min Tsmin Temperature max Tsmax Time min to max ts 150 C 200 C 60 180 seconds Tsmax to TL Ramp up rate 3 C second max Time maintained above Temperature TL Time tL 217 C 60 150 seconds Peak temperature Tp 245 0 5 C Time within 5 C of actual peak Temperature tp 10 30 seconds Ramp down rate 6 C second max Time 25 C to peak temperature 8 minutes max NOTE All temperatu...

Page 104: ... we strongly recommend to add several test pads on the host PCB for the following purposes Checking the connection between the LE910C1 itself and the application Testing the performance of the module by connecting it with an external computer Depending on the customer application these test pads include but are not limited to the following signals TXD RXD ON OFF HW_SHUTDOWN_N GND VBATT TX_AUX RX_A...

Page 105: ...ious applications Customers must pay special attention to this issue when they design their application board The length and width of the power lines must be considered carefully and the capacitance of the capacitors must be selected accordingly The capacitor will also prevent ripple of the power supplies and the switching noise caused in TDMA systems such as GSM Especially a suitable bypass capac...

Page 106: ...n particular how the application side should be designed and what values the components should have Figure 28 SIM Schematics NOTE The resistor value on SIMIO pulled up to SIMVCC must be defined to be compliant with the 3GPP specification for USIM electrical testing The LE910C1 module contains an internal pull up resistor of 20K Ω on SIMIO However the un mounted option in the application design can...

Page 107: ... Recommendations All LE910C1 signals are provided with some EMC protection Nevertheless the accepted level differs according to the specific pin Table 41 lists the characteristics Table 41 EMC Recommendations Pad Signal I O Function Contact Air All Pins All pins All functions 4KV 8KV Antenna F1 K1 R9 Antenna pads Analog I O Antenna pad 4KV 4KV Appropriate series resistors must be considered to pro...

Page 108: ...SB port in the host system to debug or upgrade the LE910C1 when it is mounted UART interface only Users who use a UART interface only to communicate with the LE910C1 module must arrange for a UART port in the host system to debug or upgrade the LE910C1 when it is mounted 11 5 1 Fast Boot mode Fast boot mode is normally used by Telit SW to enter SW download mode Fastboot is triggered by GPIO_09 PAD...

Page 109: ...lit Communications S p A All Rights Reserved Telit Confidential Information provided under NDA Page 109 of 119 12 Packing System 12 1 Packing system Tray The LE910C1 modules are packaged on trays of 36 pieces each as shown in Figure 29 These trays can be used in SMT processes for pick place handling Figure 29 Packing ...

Page 110: ...ide 1VV0301298 Rev 1 08 2017 11 14 Reproduction forbidden without written authorization by Telit Communications S p A All Rights Reserved Telit Confidential Information provided under NDA Page 110 of 119 Figure 30 Tray Drawing ...

Page 111: ...by Telit Communications S p A All Rights Reserved Telit Confidential Information provided under NDA Page 111 of 119 12 2 Tape Reel The LE910C1 can be packaged on reels of 200 pieces each See figure for module positioning into the carrier Figure 31 Module Positioning into the Carrier Figure 32 Carrier Tape Detail ...

Page 112: ...ide 1VV0301298 Rev 1 08 2017 11 14 Reproduction forbidden without written authorization by Telit Communications S p A All Rights Reserved Telit Confidential Information provided under NDA Page 112 of 119 Figure 33 Reel Detail ...

Page 113: ...unications S p A All Rights Reserved Telit Confidential Information provided under NDA Page 113 of 119 Figure 34 Reel Box Detail 12 3 Moisture Sensitivity The LE910C1 module is a Moisture Sensitive Device Level 3 in accordance with standard IPC JEDEC J STD 020 Observe all of the requirements for using this kind of components ...

Page 114: ...e the product itself The same caution must be taken for the SIM checking carefully the instructions for its use Do not insert or remove the SIM when the product is in power saving mode The system integrator is responsible for the functioning of the final product therefore care must be taken of the external components of the module as well as of any project or installation issue because of the risk...

Page 115: ...peration of the device Le présent appareil est conforme aux CNR d Industrie Canada applicables aux appareils radio exempts de licence L exploitation est autorisée aux deux conditions suivantes 1 l appareil ne doit pas produire de brouillage et 2 l utilisateur de l appareil doit accepter tout brouillage radioélectrique subi même si le brouillage est susceptible d en compromettre le fonctionnement W...

Page 116: ...r there is no guarantee that interference will not occur in a particular installation If this equipment does cause harmful interference to radio or television reception which can be determined by turning the equipment off and on the user is encouraged to try to correct the interference by one or more of the following measures Reorient or relocate the receiving antenna Increase the separation betwe...

Page 117: ...posée sur l appareil hôte à un endroit bien en vue en tout temps En l absence d étiquette l appareil hôte doit porter une étiquette donnant le FCC ID et le IC du module précédé des mots Contient un module d émission du mot Contient ou d une formulation similaire exprimant le même sens comme suit LE910C1 NA Contains FCC ID RI7LE910C1NA Contains IC 5131A LE910C1NA LE910C1 NS Contains FCC ID RI7LE910...

Page 118: ...note related to future compatibility related to few pins Updated section 3 2 Signals That Must Be Connected Updated pinout and pin description Updated pinout layout Figure 2 Remove HW RESET description section Updated serial port 2 section Updated SPI port section Updated 1 8V pads pull info Updated AUX UART section Updated GPIO section Updated mechanical drawing Cosmetic 0 5 2016 12 02 Added sect...

Page 119: ... Updated table 4 with B25 information Section 14 1 Added LE910C1 NS Max antenna gain Added LE910C1 NS FCC ID IC number 1 04 2017 05 25 Section 14 1 Added Labelling Requirements for the Host device 1 05 2017 06 18 Section 6 1 Updated power consumption tables 1 06 2017 07 10 Renaming the product from LE910Cx to LE910C1 1 07 2017 07 23 Adding a note for power supply section 1 08 2017 11 14 Section 2 ...

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