HW User Guide
1vv0301018 Rev. 15
Page
61
of
72
2019-01-07
GL865 V3/V3.1 Solder reflow
Recommended solder reflow profile
Profile Feature
Pb-Free Assembly
Average ramp-up rate (TL to TP)
3°C/second max
Preheat
– Temperature Min (Tsmin)
– Temperature Max (Tsmax)
– Time (min to max) (ts)
150°C
200°C
60-180 seconds
Tsmax to TL
– Ramp-up Rate
3°C/second max
Time maintained above:
– Temperature (TL)
– Time (tL)
217°C
60-150 seconds
Peak Temperature (Tp)
245 +0/-5°C
Time within 5°C of actual Peak
Temperature (tp)
10-30 seconds
Ramp-down Rate
6°C/second max.
Time 25°C to Peak Temperature (ttp)
8 minutes max.
NOTE:
All temperatures refer to topside of the package, measured on the
package body surface
WARNING:
The GL865 V3/V3.1 module withstands one reflow process only.
TL
Tsmin
Tsmax
ts
tL
tp
ttp
