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TM109902 (5/03)

 

 

3-9

 

 

USE OR DISCLOSURE OF DATA CONTAINED ON THIS PAGE IS SUBJECT TO THE

 

RESTRICTION ON THE TITLE PAGE OF THIS DOCUMENT

C

O M M A N D  

S

Y S T E M S  

D

I V I S I O N

 

(2)   False Alarm Check   

 

Paragraph 4.9. 

(3)   Receiver Tests 

 

 

Paragraph 4.10. 

3.7 

SEMICONDUCTOR SERVICE INFORMATION 

A.   Transistor Testing and Base Connection 

 

Tables 3-1 and 3-2 provide typical testing data for PNP and NPN transistors. 

 

NOTE 

 

The information in Tables 3-1 and 3-2 is not 
applicable for Darlington transistors. 

 

 

Table 3-3 lists the transistors used in RT-1601. Column 2 references Figure 3-1 which shows a 
base arrangement view of the transistor. Transistors having in-line leads must have leads formed 
to the standard three pin socket configuration. 

Table 3-1. 

PNP Transistor Testing Procedure 

 

OHMMETER CONNECTIONS 

 

 

CHECK NO. 

BASE 

COLLECTOR  

EMITTER 

RANGE 

RELATIVE RESISTANCE 

1 –   

RX100 or 

  RX1,000 

Low (1,000 ohms or less) 

 

– 

RX10,000  High (100,000 ohms or more) 

 

– 

RX10,000  High (100,000 ohms or more) 

 

– 

RX10,000  High (100,000 ohms or more 

5 – + 

 

RX100 or 

  RX1,000 

Low (1,000 ohms or less) 

– 

 

RX10,000  High (100,000 ohms or more) 

 7 
Connect base 
to collector 

 –  + 

RX100 or  

  RX1,000 

Resistance should decrease from that 
obtained in check 3. 

 8 

 

Connect base 
to emitter 

 

– 

RX10,000   High (100,000 ohms or more) 

 

The document reference is online, please check the correspondence between the online documentation and the printed version.

Summary of Contents for RT-1601

Page 1: ...ion damaged fasteners or damaged connectors B Connectors Inspect the connector bodies for broken parts check the insulation for cracks and check the contacts for damage misalignment corrosion or bad p...

Page 2: ...heck for corrosion at the terminal connections 3 3 CLEANING Do not use cleaning solvent on electrical parts cleaning solvent can soften and permanently damage insulating materials Wipe the exterior of...

Page 3: ...permanently damage the capacitor 3 6 REPAIR Voltage dangerous to life exists remove all power to unit before proceeding A Repair Precautions 1 Refer to paragraph 3 6B for special handling precautions...

Page 4: ...cuits are also susceptible to field voltages Not all electrostatic damage will result in immediate catastrophic failure Damaged devices may remain operating within the minimum limits but could experie...

Page 5: ...e mats Do not allow nonconductive items on the workbench This includes such items as plastic ashtrays cellophane wrappers plastic tools styrofoam coffee cups etc Maintain the relative humidity higher...

Page 6: ...ing To cool components use antistatic quick chill sprays Remember even when the ESDS device is installed on a printed circuit board it can STILL be damaged by electrostatic discharge C Printed Circuit...

Page 7: ...Board Two Lead Component Removal Resistors Capacitors Diodes etc 1 Heat from component side of board until solder flows and lift one lead from board repeat for other lead and remove component note ori...

Page 8: ...aragraph 4 8 4 Receiver Tests Paragraph 4 10 J Power Supply Fuse F1001 Replacement Refer to Figure 4 1 located in Chapter 4 Parts List The power supply fuse F1001 is located on the interconnect PC boa...

Page 9: ...e arrangement view of the transistor Transistors having in line leads must have leads formed to the standard three pin socket configuration Table 3 1 PNP Transistor Testing Procedure OHMMETER CONNECTI...

Page 10: ...igh 100 000 ohms or more Table 3 3 Transistors and Base Configurations TRANSISTOR TELEPHONICS PART N0 VENDOR TYPE NO BASE CONFIGURATION FIGURE 3 1 NOTE 12044 0009 2N5192 Q62 NPN power silicon 12044 00...

Page 11: ...Y S T E M S DI V I S I O N E T2 B C T30 CASE 3 1 2 E B C 4 T41 E C B T49 EMITTER 2 BASE 1 COLLECTOR CASE E CASE SOURCE DRA IN GATE CASE C B T62 T66 E C B E B C T23 T44 E C B T67 0757 Figure 3 1 Transi...

Page 12: ...175 54HCT175 74HC175 and 74HCT175 devices are CMOS versions of the above and may be shown in a separate IC diagram The 54AC175 and 54ACT175 devices are advanced CMOS logic ACL versions of the above AC...

Page 13: ...3 5 is a summary of possible IC failure Table 3 4 54 74 Series IC Alpha Character Significance ALPHA CHARACTER SIGNIFICANCE None Standard Transistor Transistor Logic TTL S Schottky clamped TTL device...

Page 14: ...43 D27C256 4 622 51023 0006 7 233 EP320DC 5 732 52720N 4 IC277 LM1596H 2 390 54121 15 IC400 LM218H 2 355 54LSOO 6 19 LM224N 2 524 54LS04 8 220 LM311N 2 252 54LS08 8 127 LM320T 12 6 228 54LS11 8 187 LM...

Page 15: ...26 27 28 19 20 1 4 5 6 7 3 2 8 9 10 11 12 16 15 14 13 33 30 29 34 35 36 21 22 23 24 25 37 38 39 40 31 32 1 1 3 4 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 2 4 5 6...

Page 16: ...T TO THE RESTRICTION ON THE TITLE PAGE OF THIS DOCUMENT CO M M A N D SY S T E M S DI V I S I O N Figure 3 3 Integrated Circuit Logic Diagrams Sheet 1 of 15 The document reference is online please chec...

Page 17: ...T TO THE RESTRICTION ON THE TITLE PAGE OF THIS DOCUMENT CO M M A N D SY S T E M S DI V I S I O N Figure 3 3 Integrated Circuit Logic Diagrams Sheet 2 of 15 The document reference is online please chec...

Page 18: ...S 00 07 Y GATING 32 768 BIT CELL MATRIX 32 768 BIT CELL MATRIX CE VPP GND PIN NOMENCLATURE AQ A11 E C VPP Q1 Q8 VCC 13 14 15 16 17 18 19 20 21 22 23 24 ADDRESS CHIP ENABLE OUTPUT ENABLE 21V OUTPUTS 15...

Page 19: ...T TO THE RESTRICTION ON THE TITLE PAGE OF THIS DOCUMENT CO M M A N D SY S T E M S DI V I S I O N Figure 3 3 Integrated Circuit Logic Diagrams Sheet 4 of 15 The document reference is online please chec...

Page 20: ...28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 3 4 1 IC732 2 I O ARCHITECTURE CPNTROL 19 2 76 5 4 3 2 1 0 0E I O ARCHITECTURE CPNTROL 18 76 5 4 3 2 1 0 0E I O ARCHITECTURE CPNTROL...

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