Tektronix P6450, Instruction Manual

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Reference
Signal Routing The following fi gure shows examples of pass-through signal routing for a
single-ended data con fi guration. (See Figure 14.)
Figure 14: Signal routing on the target system
Mechanical
Considerations
This section provides information on compression footprint requirements and
physical attachment requirements.
The PCB holes, in general, do not have an impact upon the integrity of your
signals when the signals routed around the holes have the corresponding return
current plane immediately below the signal trace for the entire signal path from
driver to receiver.
NOTE. For optimum signal integrity, there should be a continuous, uninterrupted
ground return plane along the entire signal path.
Electrical Considerations This section provides information on transmission lines and load models for
the P6450 probe.
The low-frequency model is typically adequate for rise and fall times of 1 ns
or slower in a typical 25
Ω source impedance environment (50 W runs with a
pass-through connection). For source impedance outside this range, and/or rise
and fall times faster than 1 ns, use the high-frequency model to determine if a
signi
fi cant difference is obtained in the modeling result.
The compression land pattern pad is not part of the load model. Make sure that
you include the compression land pad in the modeling.
P6450 High-Density Logic Analyzer Probe Instruction Manual 19