114- 40020
Rev D
3
of 9
Figure 2
Refer to Specific Customer Drawing
Refer to Specific Customer Drawing
4
5
See Figure 3
Datums V and W to be established by customer.
Distance required by ejection latches in the open position.
A= 15.37 [.605] with short eject latch
A= 17.65 [.695] with long eject latch
A
D. PC Board Plated Thru Holes
The pc board holes must be drilled and plated as shown in Figure 3.
Copper Thickness
0.03--0.08 [.001--.003]
Maximum Hardness of
Copper to be 150 Knoop
A
B
Board Thickness
2.03 [.080] Min.
Pad Diameter
1.57 [.062] Min.
Surface Finish
(See Table)
PC BOARD HOLE
DRILLED HOLE
HOLE DIA
AFTER
SURFACE FINISH
DRILLED HOLE
DIAMETER A
AFTER
PLATING
S
(B)
PLATING
THICKNESS
1.151 +0.025 [.0453 +.0010]
1.02 [.040]
Hot Air Solder Leveling (HASL) Tin--Lead (Sn--Pb) 0.008 [.0003] Min
1.151 +0.025 [.0453 +.0010]
1.02 [.040]
Immersion Tin (Sn)
0.0005--0.004 [.000020--.000160]
1.151 +0.025 [.0453 +.0010]
1.02 [.040]
Organic Solderability Preservative (OSP)
0.0002--0.0005 [.000008--.000020]
1.176 +0.025 [.0463 +.0010]
1.04 [.041]
Immersion Gold (Au) over Nickel (Ni) (ENIG)
0.0001--0.0005 [.000004--.000020] Au,
0.00127--0.0076 [.00005--.00030] Ni
1.151 +0.025 [.0453 +.0010]
1.02 [.040]
Immersion Silver (Ag)
0.0001--0.0005 [.000004--.000020]
S
Dimension is provided for reference only. The drilled hole diameter is critical and must be maintained within
specified tolerance for proper application.
Figure 3
