Data Sheet: Xeta
iHG48070A033V, 3.3V/70A Output Half Brick Series
©2008 TDK Innoveta Inc.
iHG Datasheet 2008-05-15 Revision 1.1
℡
(877) 498-0099
10/16
Thermal Performance:
Maximum output current vs. ambient temperature at nominal
input voltage for airflow rates natural convection (0.3m/s) to
3.0m/s with airflow from pin 4 to 1.
Maximum output current vs. ambient temperature at nominal
input voltage for airflow rates natural convection (0.3m/s) to
3.0m/s with airflow from pin 1 to pin 4.
Thermal measurement location – top view
The thermal curves provided are based upon measurements made in TDK Innoveta’s experimental test setup that is
described in the Thermal Management section. Due to the large number of variables in system design, TDK Innoveta
recommends that the user verify the module’s thermal performance in the end application. The critical component
should be thermo-coupled and monitored, and should not exceed the temperature limit specified in the derating curve
above. It is critical that the thermocouple be mounted in a manner that gives direct thermal contact otherwise significant
measurement errors may result.
Thermal
Measurement
Location (Drain
pad of MOSFET)
20
30
40
50
60
70
30
40
50
60
70
80
90
100
110
120
130
Ambient Temperature (C)
O
u
tp
u
t
C
u
rr
e
n
t
(A
)
NC 0.3 m/s (60 LFM)
0.5 m/s (100 LFM)
1.0 m/s (200 LFM)
1.5 m/s (300 LFM)
2.0 m/s (400 LFM)
3.0 m/s (600 LFM)
Max MOSFET Temperature
20
30
40
50
60
70
30
40
50
60
70
80
90
100
110
120
130
Ambient Temperature (C)
O
u
tp
u
t
C
u
rr
e
n
t
(A
)
NC 0.3 m/s (60 LFM)
0.5 m/s (100 LFM)
1.0 m/s (200 LFM)
1.5 m/s (300 LFM)
2.0 m/s (400 LFM)
3.0 m/s (600 LFM)
Max MOSFET Temperature
