Page 3
Rev 1.0, Jun 1, 2022
Patent Protected: US 9,729,059 B1; US 10,193,442 B2
Copyright© 2018–20 TDK Corporation. All rights reserved.
All registered trademarks and trademarks are the property of their respective owners.
Data and specifications subject to change without notice.
EV1703-3300-A
Description
The evaluation board consists of a 4-layer PCB made from FR4 glass-reinforced epoxy laminate material. All layers use
2oz copper (equating to a thickness of 0.0694mm). The major power components, including the FS1703, are mounted
on the top side of the board.
Part reference
Quantity
Type
Description
FS1703 µPOL
1
–
Main IC
C10, C21
2
22µF
0805, 16V, X5R
C12
1
0.1µF
0402, 16V, X7R
C13
1
68µF
25V
C14, C15, C16
3
22µF
0805, 6.3V, X5R
C26
1
1µF
0603, 25V, X5R
J1
1
Red
Banana connector
J2, J7
2
Black
Banana connector
J8
1
Green
Banana connector
J10, J11
2
–
3-pin header
R1
1
2.7Ω
10%, 1/8W, 0805 case size
R3, R7
2
49.9kΩ
10%, 1/8W, 0805 case size
R2, R4, R9
3
0Ω
0805 case size
C28, C29
2
0Ω (Note 1)
0402 case size
R6
1
24.9kΩ
10%, 1/8W, 0805 case size
VIN, PG, EN, VCC, SW_NC15, VOUT, PVIN, GNDs
10
–
Test points
Note 1: 0ohm is placed on capacitor footprint to ground NC pin.
Figure 1 shows the layout of the board and Figure 2 shows a schematic of the electrical circuit.
