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TDK-Lambda
CN-A110 Series
Instruction Manual
13. Series Operation
Series operation is possible for CN-A110 series. Connections
shown fig. 13-1 and fig. 13-2 are possible.
Fig.13-1 Series Operation due to High Output Voltage
Fig.13-2 Series Operation due to
±
Output
14. Operating Ambient Temperature
There is no restriction on mounting direction but there should
be enough consideration for airflow so that heat does not
accumulate around the power module vicinity.
Determine external components configuration and mounting
direction on PCB such that air could flow through the heatsink
at forced cooling and conventional cooling.
By maintaining actual baseplate temperature below 100
℃
,
operation is possible. For details on thermal design, refer to
Application Notes “Thermal Design”.
Note :
Maximum baseplate temperature is 100
℃
. For worst case
operating condition, verify baseplate temperature at
measurement point indicated in fig. 14-1.
(a) CN30,50,100A
(b) CN200A
Fig.14-1 Measurement Point of Baseplate Temperature
Fig.14-2 Derating Curve
To further improve reliability, it is recommended to use this
module with baseplate temperature derating.
15. Operating Ambient Humidity
Take note that moisture could lead to power module
abnormal operation or damage.
16. Storage Ambient Temperature
Please note that sudden temperature changes can cause
condensation buildup, and other harmful affects to each
terminal solder.
17. Storage Ambient Humidity
Take enough care when storing the power module because
rust which causes poor solderability would form in each
terminal when stored in high temperature, high humidity
environment.
Baseplate Tenperature [
℃
]
100
80
60
40
20
0
-40
O
ut
pu
t C
ur
re
nt
[%
]
-20
0
20
40
60
80
100
+V
-V
+S
-S
+
-
Load
+V
-V
+S
-S
+V
-V
+S
-S
+
-
Load
+V
-V
+S
-S
Load
+
-
Measurement Point of Baseplate Temperature
Measurement Point of Baseplate Temperature