Factory Test & Alignment Specification For MS63EP1
和
EP2-LA Series (V1.0)
Page 4 of 16
The Picture Performance assessment such as White Balance (luminance and color temperature)
has to be performed into subdued lighted room after at least
45min
of warm-up in order to avoid any
temperature drift influence (colorimetry vs time)
1. PCB/SKD Assembly: Test & Alignment
1.1.
Pre-Conditions and DC/DC Check
Before power-on, please check the board according to the relevant block diagram and circuit
diagram, and make sure that no serious issue or mistake can destroy the board. For example, the
output of DC/DC and LDO should not be shorted to ground.
Supply a suited voltage and power-on, then check the voltage according to the relevant block
diagram, circuit diagram and voltage spec . the error should less than 5% .For example, the voltage
for main chip(3.3VSTB,Core 1.1, etc.), the voltage for DDR(1.5V) , the voltage for amplifier
(AMP_VCC), etc...
Position
Value
Remark
N/A
5VSTB
±5%
N/A
U002
3.3VSTB
±5%
3.3VSB
UT1
3.3V
±5%
TU_3V3
Q001 Switch
3.3V
±5%
3.3V
U003
1.5V
±5%
1.5V
U001
1.1V
±3%
1.1V
U000
5V
±5%
5V
1.2.
SW Image download
1.3. Project ID Modification
There are different IDs stored into the NVM depending on different Panels settings and Models
features, but there’s only one key branching ProjectID that includes all. So, it’s not recommended to
modify Panel ID with Hyper terminal as other ID features may not change!
To modify Project ID, you need to go through
“
Design menu
Service menu
Project ID
”, then
spin left or right keys to suitable ID (Project name is dynamically refreshed).
See Appendix
“
How to change Project ID with RCU
”
Here below is none exhaustive ProjectID table for reference:
MODEL
Project ID
Panel Name
L32D2900
009
ST3151A05-8
Summary of Contents for 32D2900
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