20040310
1-18-1
H9602EL
ELECTRICAL PARTS LIST
PRODUCT SAFETY NOTE:
Products marked with a
#
have special characteristics important to safety.
Before replacing any of these components, read care-
fully the product safety notice in this service manual.
Don't degrade the safety of the product through
improper servicing.
NOTES:
1.
Parts that are not assigned part numbers (---------)
are not available.
2.
Tolerance of Capacitors and Resistors are noted
with the following symbols.
DVD MAIN CBA UNIT
MCV CBA
MAIN CBA
C.....±0.25%
D.....±0.5%
F.....±1%
G.....±2%
J......±5%
K.....±10%
M.....±20%
N.....±30%
Z.....+80/-20%
Ref. No.
Description
Part No.
DVD MAIN CBA UNIT
N79FNHUP
Ref. No.
Description
Part No.
MCV CBA
Consists of the following
0VSA15144
MAIN CBA (MCV-A)
DVD OPEN/CLOSE CBA (MCV-C)
SENSOR CBA
----------
----------
0VSA14947
Ref. No.
Description
Part No.
MAIN CBA (MCV-A)
----------
Consists of the following:
CAPACITORS
C013
ELECTROLYTIC CAP. 10
µ
F/50V M H7
CE1JMASSL100
C017
CERAMIC CAP. YV Z 0.01
µ
F/50V
CCD1JZSYV103
C018
ELECTROLYTIC CAP. 470
µ
F/16V M or
CE1CMASDL471
ELECTROLYTIC CAP. 470
µ
F/16V M
CE1CMASTL471
C020
ELECTROLYTIC CAP. 1000
µ
F/10V M or
CE1AMZPDL102
ELECTROLYTIC CAP. 1000
µ
F/10V M
CE1AMZPTL102
C021
ELECTROLYTIC CAP. 470
µ
F/6.3V M or
CE0KMASDL471
ELECTROLYTIC CAP. 470
µ
F/6.3V M
CE0KMASTL471
C023
ELECTROLYTIC CAP. 100
µ
F/16V M or
CE1CMASDL101
ELECTROLYTIC CAP. 100
µ
F/16V M
CE1CMASTL101
C030
CERAMIC CAP.(AX) B K 0.033
µ
F/50V
CA1J333TU011
C051
ELECTROLYTIC CAP. 10
µ
F/16V M H7
CE1CMAVSL100
C053
ELECTROLYTIC CAP. 220
µ
F/6.3V M or
CE0KMASDL221
ELECTROLYTIC CAP. 220
µ
F/6.3V M
CE0KMASTL221
C060
CHIP CERAMIC CAP. B K 0.1
µ
F/25V or
CHD1EKB0B104
CHIP CERAMIC CAP. B K 0.1
µ
F/16V or
CHD1CKB0B104
CHIP CERAMIC CAP.(1608) B K 0.1
µ
F/25V or
CHD1EK30B104
CHIP CERAMIC CAP.(1608) B K 0.1
µ
F/16V
CHD1CK30B104
C301
ELECTROLYTIC CAP. 1
µ
F/50V M H7
CE1JMAVSL1R0
C302
CHIP CERAMIC CAP. CH J 390pF/50V or
CHD1JJBCH391
CHIP CERAMIC CAP. CH J 390pF/50V or
CHD1JJ3CH391
CHIP CERAMIC CAP. CG J 390pF/50V
CHD1JJ3CG391
C303
PCB JUMPER D0.6-P5.0
JW5.0T
C304
CHIP CERAMIC CAP.(MELF) SL J 100pF/50V or
CZM1JJBSL101
CHIP CERAMIC CAP.(MELF) SL J 100pF/50V or
CZM1JJ3SL101
CHIP CERAMIC CAP. CH J 100pF/50V or
CHD1JJBCH101
CHIP CERAMIC CAP.(1608) CH J 100pF/50V or
CHD1JJ3CH101
CHIP CERAMIC CAP. CG J 100pF/50V
CHD1JJ3CG101
C305
CHIP CERAMIC CAP.(MELF) SL J 100pF/50V or
CZM1JJBSL101
CHIP CERAMIC CAP.(MELF) SL J 100pF/50V or
CZM1JJ3SL101
CHIP CERAMIC CAP. CH J 100pF/50V or
CHD1JJBCH101
CHIP CERAMIC CAP.(1608) CH J 100pF/50V or
CHD1JJ3CH101
CHIP CERAMIC CAP. CG J 100pF/50V
CHD1JJ3CG101
C307
CHIP CERAMIC CAP. F Z 1
µ
F/10V or
CHD1AZB0F105
CHIP CERAMIC CAP. F Z 1
µ
F/10V
CHD1AZ30F105
C308
ELECTROLYTIC CAP. 47
µ
F/6.3V M H7
CE0KMAVSL470
C309
CHIP CERAMIC CAP. F Z 0.1
µ
F/50V or
CHD1JZB0F104
CHIP CERAMIC CAP. F Z 0.1
µ
F/25V or
CHD1EZB0F104
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/50V or
CHD1JZ30F104
CHIP CERAMIC CAP.(1608) F Z 0.1
µ
F/25V or
CHD1EZ30F104
CHIP CERAMIC CAP. FZ Z 0.1
µ
F/50V
CHD1JZ3FZ104
C310
ELECTROLYTIC CAP. 22
µ
F/6.3V M H7
CE0KMAVSL220
C311
ELECTROLYTIC CAP. 1
µ
F/50V M H7
CE1JMASSL010
C312
CHIP CERAMIC CAP. F Z 1
µ
F/10V or
CHD1AZB0F105
CHIP CERAMIC CAP. F Z 1
µ
F/10V
CHD1AZ30F105
C313
ELECTROLYTIC CAP. 1
µ
F/50V M H7
CE1JMASSL010
C314
CHIP CERAMIC CAP. F Z 1
µ
F/10V or
CHD1AZB0F105
CHIP CERAMIC CAP. F Z 1
µ
F/10V
CHD1AZ30F105
C315
CHIP CERAMIC CAP. B K 0.1
µ
F/25V or
CHD1EKB0B104
CHIP CERAMIC CAP. B K 0.1
µ
F/16V or
CHD1CKB0B104
CHIP CERAMIC CAP.(1608) B K 0.1
µ
F/25V or
CHD1EK30B104
CHIP CERAMIC CAP.(1608) B K 0.1
µ
F/16V
CHD1CK30B104
C316
CHIP CERAMIC CAP. F Z 1
µ
F/10V or
CHD1AZB0F105
CHIP CERAMIC CAP. F Z 1
µ
F/10V
CHD1AZ30F105
C317
CHIP CERAMIC CAP. F Z 1
µ
F/10V or
CHD1AZB0F105
CHIP CERAMIC CAP. F Z 1
µ
F/10V
CHD1AZ30F105
C318
ELECTROLYTIC CAP. 22
µ
F/6.3V M H7
CE0KMAVSL220
C319
CHIP CERAMIC CAP.(MELF) F Z 0.01
µ
F/16V or
CZM1CZB0F103
CHIP CERAMIC CAP.(MELF) F Z 0.01
µ
F/16V
CZM1CZ30F103
C320
CHIP CERAMIC CAP.(MELF) F Z 0.01
µ
F/16V or
CZM1CZB0F103
CHIP CERAMIC CAP.(MELF) F Z 0.01
µ
F/16V
CZM1CZ30F103
C321
CHIP CERAMIC CAP.(MELF) F Z 0.01
µ
F/16V or
CZM1CZB0F103
CHIP CERAMIC CAP.(MELF) F Z 0.01
µ
F/16V
CZM1CZ30F103
C322
CHIP CERAMIC CAP. CH J 68pF/50V or
CHD1JJBCH680
CHIP CERAMIC CAP. CH J 68pF/50V or
CHD1JJ3CH680
CHIP CERAMIC CAP. CG J 68pF/50V
CHD1JJ3CG680
C324
CHIP CERAMIC CAP. B K 0.01
µ
F/50V or
CHD1JKB0B103
CHIP CERAMIC CAP.(1608) B K 0.01
µ
F/50V
CHD1JK30B103
C326
CHIP CERAMIC CAP. B K 0.01
µ
F/50V or
CHD1JKB0B103
CHIP CERAMIC CAP.(1608) B K 0.01
µ
F/50V
CHD1JK30B103
C327
ELECTROLYTIC CAP. 47
µ
F/6.3V M H7
CE0KMAVSL470
C328
ELECTROLYTIC CAP. 1
µ
F/50V M H7
CE1JMAVSL1R0
C329
CHIP CERAMIC CAP. B K 0.01
µ
F/50V or
CHD1JKB0B103
CHIP CERAMIC CAP.(1608) B K 0.01
µ
F/50V
CHD1JK30B103
C330
ELECTROLYTIC CAP. 1
µ
F/50V M H7
CE1JMAVSL1R0
C331
CHIP CERAMIC CAP. B K 0.01
µ
F/50V or
CHD1JKB0B103
CHIP CERAMIC CAP.(1608) B K 0.01
µ
F/50V
CHD1JK30B103
Ref. No.
Description
Part No.
