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Appendix B: System Specifications
Appendix B
System Specifications
Processors
Dual 3rd Gen Intel Xeon Scalable processors in a P+ (LGA4189) socket with up to 40 cores and the thermal design power
(TDP) of up to 270W
Note: Refer to the motherboard specifications pages on our website for updates to supported processors..
Chipset
Intel PCH C621A (LBG-R)
BIOS
AMI 64Mb SPI Flash ROM
Memory
Thirty-two slots DDR4 RDIMM/LRDIMM or Intel Optane PMem 200 Series, Up to 3200 MHz
(8TB for DDR4, or 8TB of PMem and 4TB DDR4)
Note: PMem 200 Series are supported on 3rd gen Intel Xeon Scalable Platinum, Gold and selected Silver processors.
Storage Drives
24 hot-swap: 22 SATA/SAS/NVMe 2 SATA/SAS direct attached
Two SuperDOM (Disk on Module) headers
PCI Expansion Slots
Five PCIe 4.0 x8
One PCIe 4.0 x16
One PCIe 4.0 low-profile x16
One PCIe 4.0 low-profile, internal x8
Input/Output
Network: Two to four LAN ports, varies by Ultra Riser Card
BMC: Dedicated LAN port
USB: Two USB 3.0 ports
Video : One VGA port
COM: One serial port
Motherboard
X12DPU-6; 16.8" (W) x 17.00" (L) (426.72 mm x 431.80 mm)
Chassis
219U3TS-R1K62P-T; 2U Rackmount, (WxHxD) 17.2” x 3.5” x 28.2” (437 x 89 x 717.2mm)
System Cooling
Four 8-cm heavy-duty PWM fans, two CPU heatsinks, two air shrouds to direct air flow
Power Supply
Model: PWS-1K62A-1R, 1600W redundant modules, 80Plus Titanium level; Optional: 2000W
AC Input
100-127 Vac, 50-60 Hz
200-240 Vac, 50-60 Hz
+12V
83A (100 Vac–127 Vac)
133A (200 Vac–240 Vac)
+12 V standby: 2.1A
