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Appendix B: System Specifications
Appendix B
System Specifications
Processors
3rd Gen Intel Xeon Scalable processors in a P+ (LGA-4189) socket with up to 40 cores and a thermal design power (TDP) of
up to 270W
Chipset
Intel PCH C621A
BIOS
128Mb AMI BIOS SPI Flash EEPROM
Memory
Up to 4TB of DDR4 ECC RDIMM/LRDIMM/LRDIMM 3DS with speeds up to 3200MHz in 16 slots; DIMM size Up to 256GB at
1.2V
Storage Drives
16 x3.5" hot-swap SATA/SAS hybrid drive bays
(Optional) Two rear 2.5" hot-swap SATA or NVMe bays
One M.2 NVMe
Two Super DOMs (disk on module) ports
PCI Expansion Slots
Four PCIe 4.0 x16 low profile
Two PCIe 4.0 x8 low profile (see Section 3.10 for details)
Input/Output
LAN: Two RJ45 10G BASE-T; one RJ45 dedicated BMC LAN port
USB: Four USB 3.0 ports (Rear)
One VGA port (Rear)
One COM port (Rear)
Motherboard
X12DPi-N(T)6; 12" (L) x 13" (W) (305mm x 330mm)
Chassis
CSE-829HE1C4-R1K62LPB; 2U; (WxHxD) 17.3 x 3.5 x 25.5 in. (439 x 89 x 648 mm)
System Cooling
Four heavy duty 8cm fans with optimal Fan Speed Control
One set of air shroud
Power Supply
Model: PWS-1K62A-1R, 1600W redundant modules, 80Plus Platinum Levell
AC Input
1000W: 100-127Vac / 50-60Hz
1600W: 200-240Vac / 50-60Hz
+12V
Max: 83A / Min: 0A (100Vac-127Vac)
Max: 133A / Min: 0A (200Vac-240Vac)
+12V SB
Max: 2.1A / Min: 0A
