Appendix D: System Specifications
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Appendix D
Specifications and Compliance
Processors
Intel Xeon 3rd Gen Scalable in a P4 LGA4189 type socket,
with up to 38 cores and a thermal design power (TDP) of
up to 270W
Chipset
Intel C621A
Memory
Sixteen slots for up to 2TB of 3DS LRDIMM/LRDIMM/3DS RDIMM/RDIMM/ DDR4 ECC memory with speeds of
3200/2933/2666MHz; DIMM size up to 128G at 1.2V
BIOS
256Mb SPI Flash EEPROM with AMI BIOS
Motherboard
B12DPT-6
Chassis
MCP-680-41001-0N; (WxHxD) 1.75 x 6.5 x 23.5 in. (44.5 x 165 x 597 mm)
Storage Drives
SBI-420P-1C2N: Two hot-swap 2.5" SAS or NVMe
SBI-420P-1T3N: Two hot-swap 2.5"SATA or NVMe, and one hot-swap 2.5" SATA
One M.2 SSD; an optional add-on module can provide four additional M.2 SSDs
LAN Connections
Two 25GbE onboard; an optional mezzanine card can provide two additional 25GbE, EDR, HDR, or OPA
Operating Environment
Operating Temperature: 10º to 35º C (50º to 95º F)
Non-operating Temperature: -40º to 70º C (-40º to 158º F)
Operating Relative Humidity: 8% to 90% (non-condensing)
Non-operating Relative Humidity: 5% to 95% (non-condensing)