Sun Microsystems 817-4054-15, Servise Manual

Page: 41 / 204

Chapter 2 Safety, Tools Requirements, and Periodic Maintenance 2-5
Caution – If more than one system is installed in a system cabinet, service only one
system at a time.
2.5 Handling Boards and Assemblies
Caution –
There is a separate chassis ground located on the rear of the system. It is
important to ensure that the system is properly grounded.
Caution – The system is sensitive to static electricity. To prevent damage to the
board, connect an antistatic wrist strap between you and the system.
Caution –
The boards have surface-mount components that can be broken by
flexing the boards.
To minimize the amount of board flexing, observe the following precautions:
■
Hold the board only by the handle and by the green fingerhold panels, where the
board stiffener is located. Do not hold the board
only at the ends.
■
When removing the board from the packaging, keep the board vertical until you
lay it on the cushioned ESD mat.
■
Do not place the board on a hard surface. Use a cushioned antistatic mat. The
board connectors and components have very thin pins that bend easily.
■
Be careful of small component parts located on both sides of the board.
■
Do not use an oscilloscope probe on the components. The soldered pins are easily
damaged or shorted by the probe point.
■
Transport the board in its packaging box.
Caution –
The heatsinks can be damaged by incorrect handling. Do not touch the
heatsinks while replacing or removing boards. If a heatsink is loose or broken, obtain
a replacement board.
Caution –
The heatsinks can be damaged by improper packaging. When storing or
shipping a board, ensure that the heatsinks have sufficient protection.
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