Sony XPlod MEX-BT5000, Service Manual

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2
MEX-BT5000
Power amplifier section
Outputs: Speaker outputs (sure seal connectors)
Speaker impedance: 4 ñ 8 ohms
Maximum power output: 52 W
×
4 (at 4 ohms)
General
Outputs:
Audio outputs terminal (front/rear)
Subwoofer output terminal (mono)
Power antenna relay control terminal
Power amplifier control terminal
Inputs:
Telephone ATT control terminal
Illumination control terminal
BUS control input terminal
BUS audio input/AUX IN terminal
Remote controller input terminal
Antenna input terminal
Tone controls:
Low:
±
10 dB at 60 Hz or 100 Hz (XPLOD)
Mid:
±
10 dB at 500 Hz or 1 kHz (XPLOD)
High:
±
10 dB at 10 kHz or 12.5 kHz (XPLOD)
Power requirements: 12 V DC car battery
(negative ground)
Dimensions: Approx. 178
×
50
×
183 mm
(7
1
/
8
×
2
×
7
1
/
4
in) (w/h/d)
Mounting dimensions: Approx. 182
×
53
×
162 mm
(7
1
/
4
×
2
1
/
8
×
6
1
/
2
in) (w/h/d)
Mass: Approx. 1.2 kg (2 lb 11 oz)
Supplied accessories:
Card remote commander:
Parts for installation and connections (1 set)
Your dealer may not handle some of the above listed
accessories. Please ask the dealer for detailed
information.
Note
This unit cannot be connected to a digital preamplifier
or an equalizer which is Sony BUS system compatible.
Design and specifications are subject to change
without notice.
MPEG Layer-3 audio coding technology and
patents licensed from Fraunhofer IIS and Thomson.
Wireless Communication
Communication System:
Bluetooth Standard version 2.0
Output:
Bluetooth Standard Power Class 2 (Max. +4 dBm)
Maximum communication range:
Line of sight approx. 10 m (32.8 ft)*
1
Frequency band:
2.4 GHz band (2.4000
−
2.4835 GHz)
Modulation method: FHSS
Compatible Bluetooth Profiles*
2
:
A2DP (Advanced Audio Distribution Profile)
AVRCP (Audio Video Remote Control Profile)
HFP (Handsfree Profile)
OPP (Object Push Profile)
*1
The actual range will vary depending on factors
such as obstacles between devices, magnetic
fields around a microwave oven, static electricity,
reception sensitivity, antenna's perfomance,
operating system, software application, etc.
*2
Bluetooth standard profiles indicate the purpose of
Bluetooth communication between devices.
RM-X301 (US, Canadian)
RM-X302 (AEP, UK)
RM-X303 (E)
Notes on chip component replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be
damaged by heat.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
This label is located on the bottom of the
•
AEP, UK, E model
chassis.
Flexible Circuit Board Repairing
•
Keep the temperature of the soldering iron around 270 ˚C
during repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
CAUTION – CLASS 1M INVISIBLE LASER RADIATION
WHEN OPEN.
DO NOT VIEW DIRECTLY WITH OPTICAL INSTRUMENTS.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.