KE-P42M1 (AEP) 4
TABLE OF CONTENTS
1. DISASSEMBLY ............................................. 1-1
1-1.
STAND AND COVER REMOVAL ................. 1-1
1-2.
MAIN SHIELD REMOVAL ............................. 1-1
1-3.
J AND UPE BOARDS REMOVAL .................. 1-2
1-4.
AE AND BP BOARDS REMOVAL ................. 1-2
1-5.
F AND G2 BOARDS REMOVAL .................... 1-3
1-6.
G1 BOARD REMOVAL ................................... 1-3
1-7.
PDP PANEL REMOVAL .................................. 1-4
1-8.
H1 AND H3 BOARDS REMOVAL ................. 1-5
1-9.
H2 BOARD REMOVAL ................................... 1-5
2. ADJUSTMENT .............................................. 2-1
2-1.
AGING ................................................................ 2-1
2-1-1. Aging setting .................................................. 2-1
2-1-2. Aging condition ................................................. 2-1
2-2.
ADJUSTMENT OF SIGNAL LEVEL ............... 2-1
2-2-1. Check AD (2163 case) calibration
registration items .......... 2-1
2-2-2. Y signal AD calibration of 2163 decode ....... 2-1
2-2-3. C signal AD calibration of 2163 decode ........ 2-1
2-2-4. Check AD (CCP2 case) calibration
registration items .......... 2-1
2-2-5. Y signal AD calibration of CCP2 decode ...... 2-2
2-2-6. C signal AD calibration of CCP2 decode ...... 2-2
2-2-7. Check AD (Component case) calibration
registration items .......... 2-2
2-2-8. Y signal AD calibration of component input .. 2-2
2-2-9. C signal AD calibration of componet input .... 2-2
2-3.
WHITE BALANCE ADJUSTMENT ................. 2-3
2-3-1. White balance of Color temperature “Cool” .... 2-3
2-3-2. White balance of Color temperature “Normal”
2-3
2-3-3. White balance of Color temperature “Warm” .. 2-3
3. DIAGRAMS ................................................... 3-1
3-1.
BLOCK DIAGRAMS ........................................ 3-1
3-2.
FRAME DIAGRAMS ........................................ 3-6
3-3.
CIRCUIT BOARDS LOCATION ..................... 3-7
3-4.
SCHEMATIC DIAGRAMS AND
PRINTED WIRING BOARDS .......... 3-7
(1)
Schematic Diagrams of AE Board ................ 3-8
(2)
Schematic Diagrams of BP Board ................. 3-14
(3)
Schematic Diagrams of F Board .................... 3-21
(4)
Schematic Diagrams of G1 Board ................. 3-22
(5)
Schematic Diagrams of G2 Board ................. 3-24
(6)
Schematic Diagram of H1 and H2 Boards .... 3-26
(7)
Schematic Diagram of H3 and J Boards ....... 3-27
(8)
Schematic Diagrams of UPE Board .............. 3-28
3-5.
SEMICONDUCTORS ....................................... 3-32
4. EXPLODED VIEWS ...................................... 4-1
4-1.
REAR COVER AND STAND ........................... 4-2
4-2.
CHASSIS-1 ........................................................ 4-3
4-3.
CHASSIS-2 ........................................................ 4-4
4-4.
BEZEL ASSY .................................................... 4-5
4-5.
PACKING MATERIALS .................................. 4-6
5. ELECTRICAL PARTS LIST ......................... 5-1
