CHAPTER1.
BLOCK DIAGRAM
1-1.VGN-SR Series
1-1
(END)
CPU Pro
c
essor
C2P
Micro-FCPG
A
-4
7
8
(4
7
8 -pin socket P)
North Bridge
C
a
ntig
a
PM
4
5/GM
4
5
FCBG
A
-13
2
9
South Bridge
ICH9-M
(U
S
B x 8)
(PCIE x 4)
676
m
BG
A
(
SA
T
A
x
2
)
S
L
2
8541
AQ
C
S
O-DIMM
0
667
/800
MHZDDR(II)
H
a
l
f
Mini-C
a
rd
PCIE
U
S
B
2
.0
CONN X
2
Int.
S
pe
a
ker
1.0 W
a
lt x
2
Re
a
ltek
A
LC
262
Rev.D
Ther
ma
l
S
ensor
S
M
S
C EMC140
2
-
2
CPU/GMCH)
Ther
ma
l
S
ensor
G
7
09T1UF
(H/W)
F
S
B
667
/800/10
67
MHz
667
/800 MHz
33MHZ PCI BU
S
PCIE
S
M Bus
2
X4 DMI
(Direct Medi
a
Inter
fa
ce)
PCIE
U
S
B
2
.0
SA
T
A
3Gb/s
LPC
C-Link0
SA
T
A
HDD
Bluetooth
Fin
g
er Print
FeliC
a
RICOH R5C833
C
a
rd Re
a
der
i.LINK
i-LINK
M
S
Pro/DUO
S
D C
a
rd
A
P
A2
05
7
Am
pli
f
ier
[Sony Confidential]
V
GN-
S
R
S
eries (9-85
2
-83
2
-XX)
He
a
dphone
Ja
ck
Ext. Mic In
HD
A
udio
Winbond
WPCE775L’
L
Q
FP-1
2
8
C
A
M (1.3M)
X,T
A
L
14.318MHZ
S
O-DIMM
0
667
/800
MHZDDR(II)
667
/800 MHz
Express
C
a
rd 34
U
S
B Bo
a
rd
U
S
B Bo
a
rd
TP Bo
a
rd
FP Bo
a
rd
SA
T
A
ODD
Keybo
a
rd
S
1~
S7
Sw
itch
Button Bo
a
rd
Ther
ma
l
S
ensor
G
7
81P8
f
(
V
G
A
/DIMM)
B
A
TT CONN
B
A
TT ID
Fl
a
sh BIO
S
8M bit
Lid
Sw
itch
F
A
N
Touchp
a
d
TP Bo
a
rd
G-
S
ensor
S
M Bus 1
P
S
2
PWM/T
A
CH
GPIO
S
PI
35001 Bus
TPM
TPM Bo
a
rd
M88E8040
10/100M
Nets
wa
pN
S6
81
6
01P
R
J
45
U
S
B Bo
a
rd
Pre-
A
MP
MDC 1.5
Mode
m
R
J
11
Di
g
it
a
l Int. Mic
on C
am
er
a
Module
A
MD
M8
2S
CE XT
GDDR3
BG
A
-
6
3
2
U
S
B Bo
a
rd
GDDR3
V
R
A
M
3
2
M X 3
2
b X
2
pcs
D
V
I-D
RGB
HUB
U
S
B
U
S
B
U
S
B
Gi
ga
L
A
N
DC
Ja
ck
Do
c
king
D
V
I
RGB
U
S
B
2
.0
PCIE
DC-In
RGB
L
V
D
S
WXG
A
13.3”
HDMI
To Dockin
g
D
V
I
HDMI
L
V
D
S
L
V
D
S
/RGB
RGB