CPU
Pen/C2D
Pro
c
essor
Mi
c
ro-FCBGA-
4
78
(So
c
ket
4
78-pin Mi
c
ro FCPGA)
North Bridge
C
a
ntig
a
PM
4
5/GM
4
5
FCBGA-1
3
29
CRT
FSB
667/800/1066 MHz
800/1066 MHZ
PCIE 2
X4 DMI
(Direct Media Interface)
8 USB2.0
LPC
2 PCIE
SO-DIMM 0
800/1066 MHZ
DDR(III)
20
4
pin
800/1066 MHZ
SO-DIMM 0
800/1066 MHZ
DDR(III)
20
4
pin
CK505
SLG8SP513VTR
X.TAL
14.318MHZ
Nvidi
a
N10M-GS
N10P-LP
GDDR
3
PCIE X16
GDDR
3
VRAM
3
2M X
3
2b X 2
3
2M X
3
2b X
4
CRT
LVDS
1366 X 768
1600 X 900
LVDS
HDMI
HDMI
HDA
Pre-AMP
E
x
t.Mi
c
In J
ac
k
G1
4
60R91U
A
m
plifier
Int.Spe
a
ker
0.5 W
a
lt
x
2
Int.
m
i
c
Audio_USB DB
USB 2.0
CONN.X 2
Bluetooth
CAMERA 0.
3
M
Finger Print
USB 2.0
CONN.X 1
Audio_USB DB
D
a
ughter Bo
a
rd
SATA
ODD
SATA
HDD
2 SATA 1.5Gb/s
Epress C
a
rd
34
H
a
lf Mini C
a
rd
FP Bo
a
rd
Int.
m
i
c
Re
a
ltek
ALC262VD2
Pro-HG MS DUO
SD C
a
rd
I.LINK
RICOH R5U2
3
1
C
a
rdRe
a
der
i.LINK
LANKOM
LG-2
4
1
3
S-1
South Bridge
ICH9-M
(USB
x
12)
(PCIE
x
6)
(SATA
x
2)
M
a
rvell
88E8057
9
mmx
9
mm
RJ
4
5
Tou
c
hp
a
d
FAN
Lid Swit
c
h
Fl
a
sh BIOS
16M Bit
BATT
ID
BATT
CON
N
PWM
PS2
GPIO
SP1
35001 Bus
Keybo
a
rd
SMBus 1
Winbond
WPCE775L
LQFP-128
Ther
ma
l Sensor
W8
3
L771AWG-2
(CPU/GMCH)
Ther
ma
l Sensor
G709T1UF
(H/W)
Ther
ma
l Sensor
W8
3
L771AWG-2
(VGA/DIMM)
SOT-2
3
-6
Multi
m
edi
a
Bo
a
rd
CHAPTER1.
BLOCK DIAGRAM
1-1.VPCCW Series
1-1
(END)
[Sony Confidential]
VPCCW Series (9-852-857-XX)
