4
TDM-iP1
SECTION 3
DIAGRAMS
Note on Printed Wiring Boards.
•
X
: parts extracted from the component side
•
Y
: parts extracted from the conductor side
•
a
: Through hole
•
: Pattern from the side which enables seeing
(The other layers' patterns are not indicated.)
• Note for Printed Wiring Boards and Schematic Diagrams
Note on Schematic Diagrams.
• All capacitors are in
µ
F unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
%
: indicates tolerance.
•
f
: internal tolerance.
•
C
: panel designation.
•
A
: B+ Line.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: AUDIO
L
: VIDEO
c
: OSD (On Screen Display)
• Abbreviation
CND
: Canadian model
Caution:
Pattern face side:
Parts on the pattern face side seen from
(Side B)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Side A)
the parts face are indicated.
• Waveforms
20mV/DIV, 20 nsec/DIV
17.734475 MHz
63.28 mVp-p
14.31818 MHz
92 mVp-p
2
IC006
3
(2A)
20mV/DIV, 20 nsec/DIV
– MAIN Board –
1
IC006
1
(1A)
3
IC003
qd
(XIN)
0.1 V/DIV, 50nsec/DIV
5 MHz
340 mVp-p
