2
TCM-230DV
TABLE OF CONTENTS
1. SERVICING NOTES
······················································ 2
2. GENERAL
·········································································· 3
3. DISASSEMBLY
3-1. Disassembly Flow ··························································· 4
3-2. Speaker (SP901), Cassette Lid Assy ······························· 4
3-3. Cabinet (Rear) ································································· 5
3-4. MAIN Board ··································································· 5
3-5. Mechanism Deck (MT-200DV-175) ······························· 6
4. MECHANICAL ADJUSTMENTS
······························ 7
5. ELECTRICAL ADJUSTMENTS
································ 8
6. DIAGRAMS
6-1. Note for Printed Wiring Boards and
Schematic Diagrams ······················································· 9
6-2. Printed Wiring Boards ·················································· 11
6-3. Schematic Diagram ······················································· 12
7. EXPLODED VIEWS
7-1. Cabinet Section ····························································· 13
7-2. Mechanism Deck Section-1 (MT-200DV-175) ············· 14
7-3. Mechanism Deck Section-2 (MT-200DV-175) ············· 15
8. ELECTRICAL PARTS LIST
······································· 16
In this set, the S102 (POWER) detects RECORD/PLAYBACK on.
It is mounted on the MAIN board, and therefore the RECORD/
PLAYBACK on cannot be detected with the MAIN board removed.
When making an operation check and voltage check of mechanical
deck with the MAIN board removed, fix the S102 at turn on.
– MAIN BOARD (Component Side) –
SECTION 1
SERVICING NOTES
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
S102
on
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED
LINE WITH MARK
0
ON THE SCHEMATIC DIAGRAMS
AND IN THE PARTS LIST ARE CRITICAL TO SAFE
OPERATION. REPLACE THESE COMPONENTS WITH
SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 ˚C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 ˚C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges oc-
cur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
