Sony TA-ZH1ES, Service Manual, Page: 39 / 108

TA-ZH1ES
TA-ZH1ES
39 39
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
For Printed Wiring Boards.
Note:
• X : Parts extracted from the component side.
•
Y
: Parts extracted from the conductor side.
•
f
: Internal component.
• : Pattern from the side which enables seeing.
(The other layers’ patterns are not indicated.)
Caution:
Pattern face side:
(Conductor Side)
Parts face side:
(Component Side) Parts on the pattern face side seen
from the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
Caution:
Pattern face side:
(SIDE B)
Parts face side:
(SIDE A) Parts on the pattern face side seen
from the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
• DIGITAL, DSP and USB MICRO boards are multi-layer
printed board. However, the patterns of intermediate lay-
ers have not been included in diagrams.
• Indication of transistor.
C
B
These are omitted.
E
Q
• Lead layouts
surface
CSP (Chip Size Package) Lead layout of conventional IC
For Schematic Diagrams.
Note:
• All capacitors are in μ F unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and 1/4 W or less unless otherwise
speci fi ed.
•
f
: Internal component.
•
2
: Non fl ammable resistor.
•
C
: Panel designation.
Note: The components identi fi ed by mark
0
or
dotted line with mark
0
are critical for safety.
Replace only with part number speci fi ed.
Note: Les composants identi fi és par une marque
0
sont critiques pour la sécurité.
Ne les remplacer que par une piéce portant
le numéro spéci
fi é.
•
A
: B+ Line.
•
B
: B– Line.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : WALKMAN (USB)
( ) : OPT IN/COAX IN
[ ] : LINE IN
* : Impossible to measure
• Voltages are taken with VOM (Input impedance 10 M

).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: AUDIO (ANALOG)
J : AUDIO (DIGITAL)
f
: LINE IN
h
: OPT IN
L
: COAX IN
E
: USB
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
from that of conventional IC.
• Circuit Boards Location
3.5 JACK board
XLR CONNECTOR board
6.3 JACK board
4.4 JACK board
USB MICRO board
POWER SUPPLY board
USB A board
317 REG board
VOL board
DSP board
DIGITAL board
7818 REG board
DISPLAY board
7918 REG board
LPF board
LINE IN board
LINE OUT board
Note: Among mounted electrical parts on each boards, only
parts that are described in the electrical parts list can be
replaced for repair.
The parts that are not described in the electrical parts
list cannot be replaced with single for repairing.
Note: Among mounted electrical parts on each boards, only
parts that are described in the electrical parts list can be
replaced for repair.
The parts that are not described in the electrical parts
list cannot be replaced with single for repairing.