STR-DA4300ES
2
2
STR-DA4300ES
•
Note for Printed Wiring Boards and Schematic Diagrams
•
DSP board is multi-layer printed board.
However, the patterns of intermediate-layers have not been
included in this diagrams.
•
Indication of transistor
Note on Schematic Diagram:
•
All capacitors are in
µ
F unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
•
All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
f
: internal component.
•
C
: panel designation.
•
A
: B+ Line.
•
B
: B– Line.
•
Voltages are dc with respect to ground under no-signal
(detuned) conditions.
no mark : TUNER
•
Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
•
Signal path.
F
: AUDIO (ANALOG)
J
: AUDIO (DIGITAL)
E
: VIDEO
•
The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
from that of conventional IC.
Note on Printed Wiring Board:
•
X
: parts extracted from the component side.
•
Y
: parts extracted from the conductor side.
•
f
: internal component.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
Parts on the pattern face side seen from
(Conductor Side)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Component Side) the parts face are indicated.
Caution:
Pattern face side:
Parts on the pattern face side seen from
(Side B)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Side A)
the parts face are indicated.
Lead layout of conventional IC
CSP (chip size package)
•
Lead Layouts
2.
DIAGRAMS
surface
C
B
These are omitted.
E
Q
B
These are omitted.
C
E
Q