– 2 –
TABLE OF CONTENTS
1.
GENERAL
Setting up the phone ........................................................ 3
Making and receiving calls .............................................. 3
Speed dialing ................................................................... 4
Paging .............................................................................. 4
Mounting the base unit on a wall .................................... 4
2.
DISASSEMBLY
.......................................................... 5
3.
900MHz SYSTEM OPERATION
3-1. Access method ................................................................. 7
3-2. Protocol ............................................................................ 7
4.
TEST MODE
4-1. Base Unit Test Mode A .................................................... 10
4-2. Base Unit Test Mode B .................................................... 10
4-3. Handset Test Mode .......................................................... 11
5.
ELECTRICAL ADJUSTMENTS
5-1. Base Unit Section ............................................................ 12
5-2. Handset Section ............................................................... 13
6.
DIAGRAMS
6-1. Schematic Diagram – Base Unit Section – ...................... 16
6-2. Printed Wiring board – Base Unit Section – ................... 19
6-3. Printed Wiring Board – Handset Section – ...................... 21
6-4. Schematic Diagram – Handset Section – ........................ 23
6-5. IC Pin Function Description ............................................ 26
7.
EXPLODED VIEWS
................................................ 30
8.
ELECTRICAL PARTS LIST
................................ 32
SERVICING NOTES
Flexible Circuit Board Repairing
•
Keep the temperature of the soldering iron around 270 ˚C during
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering or
unsoldering
Notes on chip component replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
!
OR DOTTED LINE
WITH MARK
!
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL
OR IN SUPPLEMENTS PUBLISHED BY SONY.