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SERVICE MANUAL

US Model

SPP-A1070

Canadian Model

SPP-A1071

SPECIFICATIONS

SPP-A1070/A1071

Ver 1.1  2001.12

9-873-145-12

Sony Corporation

2001L0500-1

Personal Audio Company

C

 2001.12

Published by Sony Engineering Corporation

CORDLESS TELEPHONE WITH ANSWERING SYSTEM

Photo: SPP-A1070

General

Operating frequency

Base unit: 902 - 905 MHz (310

µ

W)

Hand set: 925 - 928 MHz (400

µ

W)

Operating channel

30 channels

Dial signal

Tone, 10 PPS (pulse) selectable

Supplied accessories

AC power adaptor AC-T122
Telephone line cord
Rechargeable battery pack BP-T18
Belt clip
Wall bracket

Handset

Power source

Rechargeable battery pack BP-T18

Battery life

Standby: Approx. 7 days
Talk:

Approx. 7 hours

Dimensions

Approx. 2 

1

4

 x 1 

7

8

 x 7 

1

4

 inches (w/h/d),

antenna excluded
(approx. 55 x 47 x 183 mm)
Antenna: Approx. 1 

3

8

 

 

inches

(approx. 34 mm)

Mass

Approx. 7.7 oz (approx. 220 g), battery
included

Base unit

Power source

DC 9V from AC power adaptor AC-T122

Battery charging time

Approx. 12 hours

Dimensions

Approx. 6 

3

x 2 

1

4

 x 7 

1

2

 inches (w/h/d),

antenna excluded
(approx. 171 x 57 x 189 mm)
Antenna: Approx. 6 

1

 8

 inches

(approx. 153 mm)

Mass

Approx. 15 oz (approx. 412 g), wall bracket
excluded

Answering machine

Maximum recording time

Approx. 15 minutes, using incorporated IC

Greeting message

Up to 90 seconds per each

Incoming Memo message

Up to 4 minutes per message

Design and specifications are subject to
change without notice.

Summary of Contents for SPP-A1070 - Caller Id Telephone

Page 1: ...able battery pack BP T18 Battery life Standby Approx 7 days Talk Approx 7 hours Dimensions Approx 2 1 4 x 1 7 8 x 7 1 4 inches w h d antenna excluded approx 55 x 47 x 183 mm Antenna Approx 1 3 8 inches approx 34 mm Mass Approx 7 7 oz approx 220 g battery included Base unit Power source DC 9V from AC power adaptor AC T122 Battery charging time Approx 12 hours Dimensions Approx 6 3 4 x 2 1 4 x 7 1 2...

Page 2: ...nent Notice that the minus side of a tantalum capacitor may be dam aged by heat NOTE FOR REPLACEMENT OF THE EEPROM The ID cord is written in the EEPROM When replacing the EEPROM U6 on the BASE MAIN board and U4 on HAND MAIN board should be replaced together as a pair Parts No X 3381 019 1 PRIOR CHECK FOR SERVICING This set can rewrite the ID number of handset to the ID number of base unit in the t...

Page 3: ...e the EEPROM BASE MAIN board Ref No U6 HAND MAIN board Ref No U4 from the new type board and install it on the former type board as a replacement NEW FORMER TYPE DISCRIMINATION In this set with the following serial No or later BASE MAIN and HAND MAIN boards have been changed SPP A1070 Serial No 0316344 or later SPP A1071 Serial No A0103501 or later Ver 1 1 Serial No Bottom View Bottom View Serial ...

Page 4: ... flashes when a new message is recorded qg VOLUME buttons p 38 Adjusts the speaker volume qh SKIP QUICK button p 37 Press to skip to the next message Keep the button pressed for quick playback of messages qj PLAY STOP MAILBOX 1 2 3 buttons p 37 38 Plays back the messages in each mail box qk HANDSET LOCATOR button p 29 Allows you to page the handset w wa ql continued ql Hook for AC power adaptor co...

Page 5: ... H S rear assy H S FRT assy HAND MAIN board BASE MAIN board Base bottom Note Follow the disassembly procedure in the numerical order given 3 2 H S REAR ASSY 5 Remove the H S rear assy in the direction of arrow B 1 Remove the battery lid in the direction of arrow A 4 claw 3 two claws 3 two claws 2 two screws BTP3 10 A B ...

Page 6: ... ASSY 4 two screws P2 5 1 screw BTP2 6 8 3 screw BTP2 6 8 6 H S FRT assy 5 2 5 screw BTP2 6 8 9 HAND MAIN board 7 screw BTP2 6 8 1 Remove two solders of lead 4 Remove twelve solders 3 Remove solder of lead 6 RF unit hand 8 receiver BKT 2 speaker 2 8cm ...

Page 7: ...law 3 base bottom 1 five screws P3 12 7 two screws BTP2 6 6 6 two screws BTP2 6 8 0 seven screws BTP2 6 8 qa BASE KEY board 8 BASE MAIN board 4 RF unit base 2 harness 1 Remove solder of lead 9 Remove two solders of lead 5 Remove two solders of lead 3 screw BTP2 6 8 ...

Page 8: ...for the FCC testing in which the phone is tested for interference at the first middle and last RF channels The following features are provided in manual test mode Able to set operating mode of the combo chip Able to mute or unmute the audio path Able to change the RF channel Both RX and TX Able to transmit or receive data packet Able to synchronize the security code BASE UNIT 1 Entering the Manual...

Page 9: ...e encoded in manchester format for which bit 0 is represented by 500 µs high and 500 µs low while bit 1 by 500 µs low and 500 µs high If data transmission is enabled it will transmit data packet with the following fields continuously 0 500 µs low and 1 500 µs high 8 bit preamble 1010101010101010 8 bit word sync 1001101101101001 20 bit security code Restored from EEPROM 4 bit reserved data 10101010...

Page 10: ...z 936 05 MHz 27 903 65 MHz 926 40 MHz 937 10 MHz 28 904 70 MHz 927 45 MHz 938 15 MHz 29 905 75 MHz 923 70 MHz 934 40 MHz Handset Frequencies Channel Transmit Receive RX LO Frequency Frequency Frequency 00 925 05 MHz 902 30 MHz 891 60 MHz 01 926 10 MHz 903 35 MHz 892 65 MHz 02 927 15 MHz 904 40 MHz 893 70 MHz 03 923 40 MHz 905 45 MHz 894 75 MHz 04 924 45 MHz 906 50 MHz 895 80 MHz 05 925 80 MHz 903 ...

Page 11: ... B 5V LED2 LED3 LED4 LED 7 SEGMENTS LED DRIVER U10 B 5V A1 RF UNIT I TAD UNIT SP101 SYSTEM CONTROLLER U4 D11 12 ANT LINE TX MIC LIFPOUT SPK OUT LIF MIN1 SP EN ROW0 ROW4 COL0 COL2 HOOK SW BU HOOK RING DET LED SEL L DATA L CLK L LATCH 7SEG D1 7SEG D2 LINE DC RX DATA PLL DATA PLL CLK TX DATA LINE RX PLL EN CAR DET A SHIF CLK LATCH CLK QA QB QC QD QE QF QG DTMF OUT XIN XOUT IN SE IN P IN N M DAT SCK S...

Page 12: ...4 PLL EN 15 PLL CLK 16 PLL I2C DATA 17 I2C CLK 12 CAR DET 11 RX DATA EEPROM U4 96 V3 95 V4 98 V1 97 V2 27 BUZZER 30 BACK LIGHT 9 CRADLE 8 RESET X2 8MHz 2 XTIN 3 XTOUT I LED DRIVE Q2 CHARGE TERMINAL RESET SIGNAL GENERATOR Q3 5 2 3V REGULATOR U3 D5 6 LCD BACK LIGHT D14 17 KEY BACK LIGHT VOL V CID 1 K1 K2 K3 TALK 2 ABC 4 GHI 7 PQRS 9 WXYZ 5 JKL 8 TUV 6 MNO 3 DEF K16 SW1 K4 K5 K6 FLASH K17 SELECT K21 ...

Page 13: ...are indicated Parts face side Parts on the parts face side seen from Component Side the parts face are indicated Note on Schematic Diagram All capacitors are in µF unless otherwise noted pF µµF 50 WV or less are not indicated except for electrolytics and tantalums All resistors are in Ω and 1 4 W or less unless otherwise specified indicates tolerance C panel designation A B Line Power voltages are...

Page 14: ...65 R46 R45 R43 C23 D5 E C B Q8 1 12 24 13 U3 C11 R22 R35 R34 C21 R32 C34 R72 7 1 8 14 C4 R73 R10 R9 R14 R17 R19 R7 C2 C6 R18 R8 C3 R31 C19 C8 R16 R82 R37 R20 C10 C25 R4 R1 Q1 B C E R5 R6 R12 R52 R11 E C B Q9 C9 R77 C15 R28 C22 R23 R21 R29 C16 C35 R74 C12 C37 R70 R71 D10 K A D7 K K A R67 C26 C24 R40 R41 K A A K U10 1 8 16 9 R33 K A A K U2 35 4747 02 00 BASE MAIN BOARD A B C D E F G H I 1 2 3 4 5 6 ...

Page 15: ...62k 1 300 HZ27 1L COL0 COL1 COL2 COL0 COL1 COL2 ROW0 ROW1 ROW2 ROW3 ROW4 QB QA QA QB QC QC QE QE QD QD QF QF QG QG PAGE PAGE NEW_LED NEW_LED IN_LED IN_LED CHG_LED CHG_LED A1 A2 A3 A1 A2 A3 B1 B2 B3 B4 B7 B8 B9 B5 B6 B7 B8 B9 C2 C3 C4 C5 C1 C0 C3 C4 C1 C2 B0 D4 D4 D5 D5 B2 B1 B3 B4 B0 B5 B6 C5 C0 7SEGD2 7SEGD1 LED SEL L CLK L LATCH L DATA DCB_RD DC_COMPA XIN XOUT VSS_A VSS_D VDD_D VREF IN_SE IN_P I...

Page 16: ...16 16 1 2 3 4 5 5 7 SCHEMATIC DIAGRAM BASE KEY Board 5 6 PRINTED WIRING BOARD BASE KEY Board Semiconductor Location Ref No Location LED1 B 5 LED2 F 3 LED3 E 3 LED4 E 3 LED5 G 2 LED6 G 2 LED7 F 2 U1 B 3 Page 14 Page 15 ...

Page 17: ...sed open 38 XTIN I Sub system clock input terminal 32 768 kHz Not used open 39 XTOUT O Sub system clock output terminal 32 768 kHz Not used open 40 VDD Power supply terminal 5V 41 HSO O Not used fixed at L 42 HSCK O Not used open 43 SO O Not used open 44 SI I Caller ID data input from the PCC318 U3 HAND MAIN BOARD U2 TMP87C807U 3CR4 SYSTEM CONTROLLER Pin No Pin Name I O Description 1 VSS Ground te...

Page 18: ... 9 10 G H 5 9 PRINTED WIRING BOARD HAND MAIN Board D1 C 9 D2 C 8 D3 B 8 D4 A 3 D5 C 1 D6 B 1 D7 C 8 D10 B 6 D11 B 6 D12 B 6 D14 F 5 D15 G 7 D16 G 5 D17 F 7 D21 C 5 Q1 C 8 Q2 A 3 Q3 B 4 Q4 C 9 Q5 B 4 U2 B 3 U3 C 5 U4 A 4 Ref No Location Semiconductor Location ...

Page 19: ... SEG6 SEG7 SEG8 SEG9 SEG10 SEG11 SEG12 SEG13 SEG14 SEG15 SEG16 SEG17 SEG18 SEG19 SEG10 SEG11 SEG12 SEG13 SEG14 SEG15 SEG16 SEG17 SEG18 SEG19 SEG20 SEG21 SEG22 SEG23 SEG24 SEG25 SEG26 SEG27 SEG28 SEG20 SEG21 SEG22 SEG23 SEG24 SEG25 SEG26 SEG27 SEG28 SEG29 SEG30 SEG31 SEG32 SEG33 SEG34 SEG35 SEG36 SEG37 SEG38 SEG29 SEG30 SEG31 SEG32 SEG33 SEG34 SEG35 SEG36 SEG37 SEG38 SEG39 SEG40 SEG41 SEG42 SEG43 S...

Page 20: ...IN BOARD COMPLETE A1071 13 3 233 775 01 TERMINAL HS L CHARGE 14 3 230 078 01 RUBBER KEY H S 15 3 230 081 01 DIFFUSER 16 X 3381 064 1 H S REAR ASSY BUZ1 1 544 603 11 BUZZER LCD1 1 804 511 11 LCD MODULE H S MIC1 1 542 260 31 MICROPHONE ELECTRET CONDENSER SP1 1 505 593 11 SPEAKER 2 8cm SP1 2 2 2 1 BUZ1 MIC1 not supplied LCD1 3 4 3 1 14 12 9 10 7 8 16 5 15 2 13 11 6 2 BASE SET SECTION 59 58 57 56 55 6...

Page 21: ... oxide film resistor F nonflammable Items marked are not stocked since they are seldom required for routine service Some delay should be anticipated when order ing these items SEMICONDUCTORS In each case u µ for example uA µA uPA µPA uPB µPB uPC µPC uPD µPD CAPACITORS uF µF COILS uH µH C28 1 163 038 00 CERAMIC CHIP 0 1uF 25V C29 1 163 038 00 CERAMIC CHIP 0 1uF 25V C30 1 163 038 00 CERAMIC CHIP 0 1...

Page 22: ...0 1 4W R27 1 211 893 11 METAL 4 7M 10 1 4W R28 1 240 225 11 RES CHIP 48 7K 0 1 1 16W R29 1 240 225 11 RES CHIP 48 7K 0 1 1 16W R30 1 218 306 11 METAL CHIP 100K 1 1 16W R31 1 218 322 11 METAL CHIP 47K 1 1 16W R32 1 216 849 11 METAL CHIP 220K 5 1 16W R33 1 216 864 11 METAL CHIP 0 5 1 16W R34 1 216 865 11 METAL CHIP 3K 5 1 16W R35 1 216 865 11 METAL CHIP 3K 5 1 16W R36 1 249 510 11 CARBON 18 5 1 4W R...

Page 23: ... CERAMIC CHIP 0 1uF 10 16V C8 1 107 826 11 CERAMIC CHIP 0 1uF 10 16V C9 1 127 715 11 CERAMIC CHIP 0 22uF 10 16V C10 1 127 715 11 CERAMIC CHIP 0 22uF 10 16V C11 1 127 715 11 CERAMIC CHIP 0 22uF 10 16V C12 1 127 715 11 CERAMIC CHIP 0 22uF 10 16V C13 1 127 715 11 CERAMIC CHIP 0 22uF 10 16V C14 1 107 826 11 CERAMIC CHIP 0 1uF 10 16V C15 1 107 826 11 CERAMIC CHIP 0 1uF 10 16V C16 1 162 923 11 CERAMIC C...

Page 24: ...5 1 16W R45 1 216 833 11 METAL CHIP 10K 5 1 16W R46 1 216 798 11 METAL CHIP 12 5 1 16W A1071 R47 1 216 798 11 METAL CHIP 12 5 1 16W A1071 R54 1 216 835 11 METAL CHIP 15K 5 1 16W R55 1 216 839 11 METAL CHIP 33K 5 1 16W R57 1 216 821 11 METAL CHIP 1K 5 1 16W SWITCH SW1 1 571 188 21 SWITCH TACTILE REFLOW TYPE VOL V CID SW2 1 571 188 21 SWITCH TACTILE REFLOW TYPE VOL v DIR IC U2 6 800 573 01 IC TMP87C...

Page 25: ...25 SPP A1070 A1071 MEMO ...

Page 26: ...sed page Also clicking the version at the upper right on the revised page allows you to jump to the next revised page Ver Date Description of Revision 1 1 2001 12 Change of BASE MAIN HAND MAIN boards ENG 01025 Addition of BASE TOP and BASE BOTTOM for SPP A1071 SPM 01054 1 0 2001 06 New ...

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