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TABLE OF CONTENTS
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
1. SERVICE NOTE
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2. GENERAL
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3. DISASSEMBLY
3-1. Cabinet (rear) Assy, Lid Sub Assy, Cassette ··················· 5
3-2. MAIN Board, Mechanism Deck ····································· 5
3-3. Belt ·················································································· 6
3-4. Head ················································································ 6
3-5. Motor, DC ······································································· 7
3-6. Precaution For Attaching The MAIN Board ··················· 7
4. ADJUSTMENT
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5. DIAGRAMS
5-1. Block Diagram ································································ 9
5-2. Schematic Diagram ······················································· 11
5-3. Printed Wiring Board –MAIN Section – ······················ 15
5-4. Printed Wiring Board –LED Section – ························· 20
5-5. IC Block Diagrams ······················································· 24
5-6. IC Pin Function Discription ·········································· 26
6. EXPLODED VIEWS
6-1. MAIN Section -1 ·························································· 27
6-2. MAIN Section -2 ·························································· 28
6-3. Mechanism Deck Section -1 ········································· 29
6-4. Mechanism Deck Section -2 ········································· 30
7. ELECTRICAL PARTS LIST
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