35
MDS-S50
Note on Printed Wiring Board:
•
X
: parts extracted from the component side.
•
Y
: parts extracted from the conductor side.
•
: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:
Parts on the pattern face side seen from
(Conductor Side)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Component Side)
the parts face are indicated.
6-3.
NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
Note on Schematic Diagram:
• All capacitors are in
µ
F unless otherwise noted. pF:
µµ
F
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in
Ω
and
1
/
4
W or less unless otherwise
specified.
•
f
: internal component.
•
5
: fusible resistor.
•
C
: panel designation.
•
A
: B+ Line.
•
B
: B– Line.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : STOP
(
) : PLAY
<
> : REC
∗
: Impossible to measure
• Voltages are taken with a VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal produc-
tion tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal produc-
tion tolerances.
• Circled numbers refer to waveforms.
• Signal path.
E
: PLAY (ANALOG OUT)
j
: REC (ANALOG IN)
l
: REC (DIGITAL IN)
• Abbreviation
AR
: Argentina model
AUS
: Australian model
BR
: Brazilian model
CND : Canadian model
HK
: Hong Kong model
SP
: Singapore model
Note:
The components identi-
fied by mark
0
or dotted
line with mark
0
are criti-
cal for safety.
Replace only with part
number specified.
Note:
Les composants identifiés par
une marque
0
sont critiques
pour la sécurité.
Ne les remplacer que par une
pièce por tant le numéro
spécifié.
• Indication of transistor
C
B
These are omitted.
E
Q
B
These are omitted.
C
E
Q
B
These are omitted.
C
E
Q
