MDR-RF830
— 7 —
— 8 —
Note:
•
X
: parts extracted from the component side.
•
®
: Through hole.
•
b
: Pattern from the side which enables seeing.
Caution:
Pattern face side:
Parts on the pattern face side seen from
(SideB)
the pattern face are indicated.
Parts face side:
Parts on the parts face side seen from
(Side A)
the parts face are indicated.
3.1 PRINTED WIRING BOARDS
Ref. No.
Location
D301
B-3
D302
E-3
D303
D-4
IC301
D-3
IC302
C-4
IC303
C-3
IC304
C-3
Q301
C-3
Q302
E-3
Q303
C-4
Q304
E-4
Q305
E-3
Q306
E-3
Q307
C-3
Q308
D-3
Q309
C-3
• Semiconductor
Location