2
MDR-RF5000/RF6000
TABLE OF CONTENTS
Specifications ............................................................................ 1
1.
GENERAL
................................................................... 3
2.
DISASSEMBLY
2-1. Disassembly Flow ................................................. 4
2-2. Front Plate (L) Assy .............................................. 4
2-3. BATT Board .......................................................... 5
2-4. Housing (L) Assy .................................................. 5
2-5. Front Plate (R) Assy .............................................. 6
2-6. RX Board .............................................................. 6
2-7. Housing (R) Assy .................................................. 7
3.
DIAGRAMS
3-1.
Block Diagrams ............................................................... 9
3-2.
Printed Wiring Boards– BATT, SWITCH Boards– ......... 10
3-3.
Printed Wiring Boards– RX Board– ................................ 11
3-4.
Schematic Diagram ......................................................... 12
4.
EXPLODED VIEWS
4-1.
Housing (L) Assy Section ................................................ 14
4-2.
Housing (R) Assy Section ............................................... 15
4-3.
Head Band Assy Section ................................................. 16
5.
ELECTRICAL PARTS LIST
.................................. 17
Notes on chip component replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be
damaged by heat.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
•
Unleaded solder melts at a temperature about 40
°
C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°
C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
•
Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
•
Repaier MDR-RF5000 with TMR-RF5000, and repaier MDR-
RF6000 with DP-RF6000.
