Sony MDR-NC300D, Service Manual

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MDR-NC300D
2
1. SERVICING NOTES
............................................. 2
2. DISASSEMBLY
2-1. Disassembly Flow ........................................................... 3
2-2. Case
Assy ........................................................................ 3
2-3. Headphone Assy ............................................................. 4
2-4. SUB Board ...................................................................... 5
2-5 LCD Sub Assy (SVX) ..................................................... 6
2-6. MAIN
Board ................................................................... 7
3. TEST MODE
............................................................ 7
4. ELECTRICAL ADJUSTMENT
........................... 7
5. DIAGRAMS
5-1. Block Diagram ................................................................ 8
5-2. Printed Wiring Board - MAIN Board - ........................... 10
5-3. Schematic Diagram - MAIN Board - .............................. 11
5-4. Printed Wiring Board - SUB Board - .............................. 12
5-5. Schematic Diagram - SUB Board - ................................. 13
6. EXPLODED VIEWS
6-1. Case Section .................................................................... 17
6-2. Chassis Section ............................................................... 18
7. ELECTRICAL PARTS LIST
.............................. 19
Accessories are given in the last of the electrical parts list.
TABLE OF CONTENTS
SECTION 1
SERVICING NOTES
NOTE THE CN302, IC301, IC302, IC303, IC304 AND
IC501 ON THE MAIN BOARD REPLACING
CN302, IC301, IC302, IC303, IC304 and IC501 on the MAIN
board cannot exchange with single. When these parts are damaged,
exchange the entire mounted board.
NOTE THE CN301, IC403, IC404, IC405, IC406, IC407,
IC601, IC602 AND Q404 ON THE SUB BOARD RE-
PLACING
CN301, IC403, IC404, IC405, IC406, IC407, IC601, IC602 and
Q404 on the SUB board cannot exchange with single. When these
parts are damaged, exchange the entire mounted board.
NOTE THE MAIN BOARD, SUB BOARD OR HEAD-
PHONE ASSY REPLACING
When the MAIN board, SUB board or headphone assy are replaced, ex-
ecute the adjustment referring to “NOISE CANCEL VOLUME ADJUST-
MENT” (page 7) on the electrical adjustment.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(
Caution:
Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
Ver. 1.2