2
M-670V/673V/675V
TABLE OF CONTENTS
Specifications ............................................................................ 1
1.
GENERAL
................................................................... 3
2.
DISASSEMBLY
2-1.
Cassette Lid Assy ............................................................ 4
2-2.
Cabinet (Rear) ................................................................. 4
2-3.
Main Board ...................................................................... 5
2-4.
Mechanism Deck (MZ-670-99), LED Board .................. 5
2-5.
Ceramic Head (REC/PB/Erase) (HRPE901) ................... 6
2-6.
Motor (M901) .................................................................. 6
3.
ADJUSTMENTS
........................................................ 7
4.
DIAGRAMS
4-1.
Block Diagrams ............................................................... 9
4-2.
Printed Wiring Boards– Main Section (Side A)– ............ 10
Printed Wiring Boards– Main Section (Side B)– ............ 11
4-3.
Schematic Diagram ......................................................... 12
4-4.
IC Block Diagrams .......................................................... 13
5.
EXPLODED VIEWS
5-1.
Cabinet (Rear) Section .................................................... 14
5-2.
Cabinet (Front) Section ................................................... 15
5-3.
Mechanism Deck Section (MZ-670-99) .......................... 16
6.
ELECTRICAL PARTS LIST
.................................. 17
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270
°
C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
