2
ICF-C1200
Specifications ........................................................................... 1
1. GENERAL
...................................................................... 2
2. DISASSEMBLY
2-1. Main Board ................................................................. 3
3. ELECTRICAL ADJUSTMENTS
3-1. Tuner Section .............................................................. 4
4. DIAGRAMS
4-1. Explanation of IC Terminals ....................................... 6
4-2. Block Diagram ............................................................ 7
4-3. Printed Wiring Boards
– Main Section (1/2) (Side A) – .................................. 8
4-4. Printed Wiring Boards
– Main Section (2/2) (Side B) – .................................. 9
4-5. Schematic Diagram ................................................... 10
5. EXPLODED VIEWS
5-1. Main Section ............................................................. 13
6. ELECTRICAL PARTS LIST
...................................
14
TABLE OF CONTENTS
SECTION 1
GENERAL
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
LOCATION AND FUNCTION OF CONTROLS
This section is extracted from
instruction manual.
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UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the
lead-free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed
with the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40
°
C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to
be applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set
to about 350
°
C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to
flow) than ordinary solder so use caution not to let solder
bridges occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder
may also be added to ordinary solder.