4-142
HDCU3300/MM (J,E)
(SDP-15 BOARD suffix 12)
Ref. No.
or Q’ty Part No. SP Description
C308 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C309 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C313 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C314 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C316 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C317 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C319 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C320 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C321 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C322 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C323 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C324 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C325 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C326 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C327 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C328 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C329 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C330 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C331 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C332 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C333 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C334 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C335 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C336 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C337 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C338 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C339 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C340 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C341 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C342 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C343 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C344 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C345 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C346 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C347 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C348 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C349 1-164-939-81 s CAP, CHIPCERAMIC 2200PF B 1005
C350 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C351 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C354 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C355 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C356 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C357 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C358 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C359 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C360 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C361 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C362 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C363 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C365 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C366 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C368 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C369 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C401 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C402 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C403 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C408 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C410 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C412 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
(SDP-15 BOARD suffix 12)
Ref. No.
or Q’ty Part No. SP Description
C112 1-125-891-91 s CAP, CHIP CERAMIC0.47MF B 1608
C113 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C114 1-100-055-21 s CAP, CHIP CERAMIC 22MF B 3225
C115 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C116 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C117 1-164-850-81 s CAP, CHIP CERAMIC 10PF CH 1005
C118 1-164-850-81 s CAP, CHIP CERAMIC 10PF CH 1005
C119 1-164-937-81 s CAP, CHIPCERAMIC 1000PF B 1005
C120 1-164-937-81 s CAP, CHIPCERAMIC 1000PF B 1005
C121 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C122 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C123 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C124 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C125 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C221 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C225 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C226 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C227 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C228 1-100-507-91 s CAP, CERAMIC 4.7MF C (1608)
C229 1-164-939-81 s CAP, CHIPCERAMIC 2200PF B 1005
C230 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C231 1-164-939-81 s CAP, CHIPCERAMIC 2200PF B 1005
C232 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C233 1-100-567-81 s CAP,CHIP CERAMIC 0.01MF B 1005
C234 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C235 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C236 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C237 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C238 1-100-506-91 s CAP, CERAMIC 1MF C (1005)
C239 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C246 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C248 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C249 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C250 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C251 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C252 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C253 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C254 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C255 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C256 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C257 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C258 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C259 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C260 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C261 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C262 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C263 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C264 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C265 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C266 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C267 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C268 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C269 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C270 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C271 1-165-989-91 s CAP, CERAMIC 10MF (2012)
C301 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C302 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C303 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
C305 1-125-777-81 s CAP, CHIP CERAMIC 0.1MF B 1005
Summary of Contents for HDCU3300 HD
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