Sony HCD-ZUX999, Service Manual, Page: 29 / 122

HCD-ZUX999
HCD-ZUX999
29 29
SECTION 5
DIAGRAMS
• Circuit Boards Location
SH-TAS board
FL-TUBE board
L-SHAPE ILLUMINATION-B board
L-SHAPE ILLUMINATION-A board
USB-A board
LEFT PANEL board
LEFT ENTER board
MASTER VOLUME board
PANEL FUNCTION board
RIGHT PANEL board
X-ROUND JOG board
RIGHT ENTER board
MICROPHONE board
CROSS FADER board
HEADPHONE board
DISC FUNCTION board
OPEN/CLOSE KEY board
BOTTOM SIRCS board
USB-B board
BD board
AMP board
SPEAKER TERMINAL board
DRIVER board
MAIN board
REGULATOR board
SW board
SENSOR board
SUB PT board
PT board
MOTOR (TB) board
MOTOR (LD) board
For Schematic Diagrams.
Note:
• All capacitors are in
μ
F unless otherwise noted. (p: pF) 50
WV or less are not indicated except for electrolytics and
tantalums.
• All resistors are in
Ω
and 1/4 W or less unless otherwise
speci fi ed.
• 2 : Non fl ammable resistor.
•
C
: Panel designation.
THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
•
A
: B+ Line.
•
B
: B– Line.
• Voltages and waveforms are dc with respect to ground
under no-signal (detuned) conditions.
no mark : TUNER
< > : CD PLAY
*
: Impossible to measure
• Voltages are taken with VOM (Input impedance 10 M
Ω
).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F
: TUNER (ANALOG)
L
: TUNER (DIGITAL)
J
: CD PLAY (ANALOG)
c
: CD PLAY (DIGITAL)
N
: MIC
• Abbreviation
E2
: 120V AC area in E model
E3 : 240V AC area in E model
E51 : Chilean and Peruvian models
MX : Mexican model
For Printed Wiring Boards.
Note:
• X : Parts extracted from the component side.
•
Y
: Parts extracted from the conductor side.
• : Pattern from the side which enables seeing.
(The other layers’ patterns are not indicated.)
• Indication of transistor.
B
These are omitted.
E
Q
G
These are omitted.
S
Q
B
These are omitted.
C E
Q
Note: The components identi fi ed by mark
0
or dotted
line with mark
0
are critical for safety.
Replace only with part number speci fi ed.
Caution:
Pattern face side:
(Conductor Side)
Parts face side:
(Component Side) Parts on the pattern face side seen
from the pattern face are indicated.
Parts on the parts face side seen from
the parts face are indicated.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(
Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution:
The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
• Abbreviation
E2
: 120V AC area in E model
E3 : 240V AC area in E model
E51 : Chilean and Peruvian models
MX : Mexican model