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2
HCD-SPZ90DAB
Notes on chip component replacement
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
•
Keep the temperature of the soldering iron around 270 ˚C
during repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
TABLE OF CONTENTS
1.
SERVICING NOTES
............................................... 3
2.
GENERAL
................................................................... 4
3.
DISASSEMBLY
3-1. Disassembly Flow ........................................................... 6
3-2. Case ................................................................................. 6
3-3. Front Panel Assy .............................................................. 7
3-4. Tape Mechanical Deck (CFP42601) ............................... 7
3-5. MAIN Board .................................................................... 8
3-6. Base Unit (BU-K6BD83S-WOD Assy)/
Belt (DLM3A) ................................................................. 8
3-7. AMP/SP/POWER Boards ............................................... 9
3-8. DAB Module Assy .......................................................... 9
4.
TEST MODE
.............................................................. 10
5.
MECHANICAL ADJUSTMENTS
....................... 12
6.
ELECTRICAL ADJUSTMENTS
......................... 12
7.
DIAGRAMS
7-1. Block Diagram – CD SERVO Section – ......................... 15
7-2. Block Diagram – MAIN Section – .................................. 16
7-3. Block Diagram – AMP Section – .................................... 17
7-4. Block Diagram
– PANEL/POWER SUPPLY Section – ........................... 18
7-5. Printed Wiring Board – CD Board – ............................... 20
7-6. Schematic Diagram – CD Board – .................................. 21
7-7. Printed Wiring Board – TC Board – ................................ 22
7-8. Schematic Diagram – TC Board – .................................. 23
7-9. Printed Wiring Boards – DAB Section – ......................... 24
7-10. Schematic Diagram – DAB Section – ............................. 25
7-11. Printed Wiring Board – MAIN Board – .......................... 26
7-12. Schematic Diagram – MAIN Board (1/3) – .................... 27
7-13. Schematic Diagram – MAIN Board (2/3) – .................... 28
7-14. Schematic Diagram – MAIN Board (3/3) – .................... 29
7-15. Printed Wiring Board – AMP Board – ............................ 30
7-16. Schematic Diagram – AMP Board – ............................... 31
7-17. Printed Wiring Board – PANEL Section (1/2) – ............. 32
7-18. Printed Wiring Boards – PANEL Section (2/2) – ............ 33
7-19. Schematic Diagram – PANEL Section (1/2) – ................ 34
7-20. Schematic Diagram – PANEL Section (2/2) – ................ 35
7-21. Printed Wiring Board – POWER Board – ....................... 36
7-22. Schematic Diagram – POWER Board – .......................... 37
8.
EXPLODED VIEWS
8-1. Overall Section ................................................................ 52
8-2. Front Panel Section ......................................................... 53
8-3. FL Section ....................................................................... 54
8-4. CD Section ...................................................................... 55
8-5. Power Section .................................................................. 56
9.
ELECTRICAL PARTS LIST
................................ 57
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE
WITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
DAB frequency table (Band-III)
Frequency
Label
Frequency
Label
174.928 MHz
5A
209.936 MHz
10A
176.640 MHz
5B
211.648 MHz
10B
178.352 MHz
5C
213.360 MHz
10C
180.064 MHz
5D
215.072 MHz
10D
181.936 MHz
6A
216.928 MHz
11A
183.648 MHz
6B
218.640 MHz
11B
185.360 MHz
6C
220.352 MHz
11C
187.072 MHz
6D
222.064 MHz
11D
188.928 MHz
7A
223.936 MHz
12A
190.640 MHz
7B
225.648 MHz
12B
192.352 MHz
7C
227.360 MHz
12C
194.064 MHz
7D
229.072 MHz
12D
195.936 MHz
8A
230.784 MHz
13A
197.648 MHz
8B
232.496 MHz
13B
199.360 MHz
8C
234.208 MHz
13C
201.072 MHz
8D
235.776 MHz
13D
202.928 MHz
9A
237.488 MHz
13E
204.640 MHz
9B
239.200 MHz
13F
206.352 MHz
9C
208.064 MHz
9D
* Frequencies are displayed to two decimal places on this system.
General
Power requirements: 220 – 240 V AC, 50/60 Hz
Power consumption: 40 watts
Dimensions (w/h/d) (excl. speakers): Approx. 180
×
280
×
331 mm
Mass (excl. speakers): Approx. 4.3 kg
Design and specifications are subject to change without notice.
This appliance is classified
as a CLASS 1 LASER
product. This marking
is located on the rear
exterior.
Summary of Contents for HCD-SPZ90DAB
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