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31
31
HCD-SA30
5-5.
Printed
Wiring Boar
d — DMB Section (SIDE A) —
• See page 23 f
or Circuit Boards Location.
•
:
Uses unleaded solder
.
TO
I/O BOARD
CN107
(Page 50)
TO
AMP BOARD
CN302
(Page 47)
TO
RF BOARD
CN002
(Page 29)
TO
UCOM BOARD
CN512
(Page 44)
FOR
CHECK
TO
UCOM BOARD
CN514
(Page 43)
TO
UCOM BOARD
CN515
(Page 43)
TO
I/O BOARD
CN106
(Page 51)
E
E
IC701
IC207
IC509
IC901
IC906
IC904
IC902
IC211
IC810
IC803
IC393
IC503
IC258
IC256
IC259
IC255
IC216
IC801
12
3
1
2
3
1
1
3
5
4
2
3
17
•
Semiconductor
Location
Ref
. No.
Location
D202
C-5
D901
D-2
IC207
B-6
IC211
C-4
IC216
D-7
IC255
A-5
IC256
B-5
IC258
B-5
IC259
A-5
IC393
D-1
IC503
C-4
IC509
D-4
IC701
D-6
IC801
B-4
IC803
C-3
IC810
C-4
IC901
C-2
IC902
C-6
IC904
C-6
IC906
C-5
Q903
A-2
Q904
A-2