![background image](http://html.mh-extra.com/html/sony/hcd-rg88/hcd-rg88_service-manual_420862028.webp)
HCD-RG88
28
28
7-6.
PRINTED WIRING BOARD – BD Board –
•
See page 27 for Circuit Boards Location.
qg
IC501
qd
(X-OUT)
qf
IC501
qa
(XC-OUT)
2.4 Vp-p
30.5
µ
s
1.9 Vp-p
62.5 ns
• Waveforms
– BD Board –
1.1
±
0.4 Vp-p
1
IC103
qg
(RFAC) (CD Play Mode)
2.5 Vp-p
7.5
µ
s
2
IC101
wh
(MDP) (CD Play Mode)
0.3 Vp-p
3
IC101
el
(TE) (CD Play Mode)
0.4 Vp-p
4
IC101
ra
(TE) (CD Play Mode)
0.65
±
0.15 Vp-p
5
IC101
t;
(RFDC) (CD Play Mode)
5 Vp-p
59 ns
2.1 Vp-p
12.1
µ
s
qa
Q302, Q303 (Base) (Rec Mode)
10.8Vp-p
12.1
µ
s
qs
Q302, Q303 (Collector) (Rec Mode)
6
IC101
yj
(XTAO)
– MAIN Board –
0.4 Vp-p
12.1
µ
s
qd
Q302, Q303 (Emitter) (Rec Mode)
2.8 Vp-p
250 ns
wa
IC601
is
(X0)
– PANEL Board –
IC102
IC101
IC103
A
B
C
D
1
2
3
4
M102
(SLED)
2
8
7
1
M101
(SPINDLE)
OPTICAL PICK-UP
BLOCK
(A-MAX.3)
TP
(DVC)
TP
(RFAC)
TP
(FEI)
TP
(FEO)
TP
(TEO)
TP
(RFDC)
(Page 33)
D101
B-4
IC101
C-3
IC102
B-2
IC103
D-2
Q101
C-1
Q102
B-4
• Semiconductor
Location
Ref. No.
Location
Summary of Contents for HCD-RG88
Page 75: ...75 HCD RG88 MEMO ...