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HCD-GPX5
29
29
6-9.
PRINTED WIRING BOARD – CN Board –
•
See page 25 for Circuit Boards Location.
:Uses unleaded solder.
CN701
CN702
JW703
JW704
JW702
JW701
CN BOARD
1-862-312-
11
(11)
A
B
C
1
2
•
Waveforms
– MAIN Board –
0.1 V/DIV, 2 ms/DIV
0.1 V/DIV, 2 ms/DIV
0.2 V/DIV, 0.5
µ
s/DIV
1 V/DIV, 0.1
µ
s/DIV
– BD Board –
5 V/DIV, 20
µ
s/DIV
IC101
w;
(TEI)
(CD Play Mode)
2
IC101
ws
(FEI)
(CD Play Mode)
3
IC101
ek
(RFACO)
(CD Play Mode)
4
IC101
us
(XTAO)
1
Q303, 304 (Collector)
(REC Mode)
1
1 V/DIV, 10
µ
s/DIV
500 mV/DIV, 20 ns/DIV
2 V/DIV, 1 s/DIV
2
Q303, 304 (Base)
(REC Mode)
4
IC306
qd
(XOUT)
5
IC306
of
(TC END SW)
(Tape Play Mode)
1 V/DIV, 10
µ
s/DIV
3
IC306
qa
(XCOUT)
Approx.
400 mVp-p
Approx.
200 mVp-p
0.7 Vp-p
59
µ
s
3.4 Vp-p
21.2
µ
s
12.4 Vp-p
21.2
µ
s
2.6 Vp-p
30.4
µ
s
3.2 Vp-p
62.6 ns
2 Vp-p
6.3Vp-p
2 s
Summary of Contents for HCD-GPX5
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