Sony HCD-EC68P, Service Manual

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HCD-EC68P/EC78P
3
1. SERVICING NOTES
............................................. 3
2. GENERAL
.................................................................. 6
3. DISASSEMBLY
3-1. Disassembly Flow ........................................................... 10
3-2. Side Panel (L)/(R) ........................................................... 11
3-3. Panel
(Top) ...................................................................... 11
3-4. MAIN Board ................................................................... 12
3-5. Front Panel Block (EC78P: UK) .................................... 12
3-6. Front Panel Block (EC68P/EC78P: US, Canadian) ........ 13
3-7. Back Panel Block ............................................................ 13
3-8. 3 CD Mechanism Block (EC78P: UK) ........................... 14
3-9. Base Unit (EC78P: UK) .................................................. 14
3-10. 1 CD Mechanism Block
(EC68P/EC78P: US, Canadian) ...................................... 15
3-11. Base Unit (EC68P/EC78P: US, Canadian) ..................... 15
3-12. Belt (EC68P/EC78P: US, Canadian) .............................. 16
3-13. Belt (EC78P: UK) ........................................................... 16
3-14. OP Base Assy (KSM-213D) ........................................... 17
4. TEST MODE
............................................................ 18
5. ELECTRICAL ADJUSTMENTS
........................ 22
6. DIAGRAMS
6-1. Block Diagram - CD SERVO, TUNER Section - ........... 25
6-2. Block Diagram - MAIN Section - ................................... 26
6-3. Printed Wiring Board - CD Board - ................................ 28
6-4. Schematic Diagram - CD Board - ................................... 29
6-5. Printed Wiring Boards - MAIN Section - ....................... 30
6-6. Schematic Diagram - MAIN Section (1/3) - ................... 31
6-7. Schematic Diagram - MAIN Section (2/3) - ................... 32
6-8. Schematic Diagram - MAIN Section (3/3) - ................... 33
6-9. Printed Wiring Board - HI AMP Board (EC78P) - ......... 34
6-10. Schematic Diagram - HI AMP Board (EC78P) - ............ 34
6-11. Printed Wiring Board - LOW AMP Board - ................... 35
6-12. Schematic Diagram - LOW AMP Board - ...................... 35
6-13. Printed Wiring Board - PANEL Board - ......................... 36
6-14. Schematic Diagram - PANEL Board - ............................ 37
6-15. Printed Wiring Boards - KEY Section - .......................... 38
6-16. Schematic Diagram - KEY Section - .............................. 38
6-17. Printed Wiring Board - MOTOR Board
(EC68P/EC78P: US, Canadian models) - ....................... 39
6-18. Schematic Diagram - MOTOR Board
(EC68P/EC78P: US, Canadian models) - ....................... 39
6-19. Printed Wiring Board - PT Board - ................................. 40
6-20. Schematic Diagram - PT Board - .................................... 41
7. EXPLODED VIEWS
7-1. Panel Section ................................................................... 47
7-2. Front Panel Section ......................................................... 48
7-3. Chassis
Section ............................................................... 49
7-4. Main Section ................................................................... 50
7-5. 3 CD Mechanism Section (EC78P: UK)
(CDM88A-K6BD90-WOD)
........................................... 51
7-6. 1 CD Mechanism Section (Except EC78P: UK)
(CDM77B-K6BD90-WOD)
........................................... 52
8. ELECTRICAL PARTS LIST
.............................. 53
TABLE OF CONTENTS
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostat-
ic break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The
fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc re
fl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
RELEASING THE DISC TRAY LOCK
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
Releasing Procedure:
1. Press [ I /
1
] button to turn the power on.
2. Press the [FUNCTION] button to select CD function.
3. While pressing the [
x
] button, press the [
Z
] button for more 5
seconds).
4. The message “UNLOCKED” is displayed and the disc tray is
unlocked.
Note: When
“
LOCKED
”
is displayed, the slot lock is not released by
turning power on/off with the
[ I /
1
]
button.