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3
HCD-DP800AV
This appliance is classified as a CLASS 1 LASER product. The
CLASS 1 LASER PRODUCT MARKING is located on the rear
exterior.
Laser component in this product is capable
of emitting radiation exceeding the limit for
Class 1.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous radiation
exposure.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
TABLE OF CONTENTS
MODEL IDENTIFICATION
— BACK PANEL —
• Abbreviation
CND : Canadian model
MX
: Mexican model
KR
: Korea model
AR
: Argentine model
AUS
: Australian model
PARTS No.
1. GENERAL
·········································································· 4
2. DISASSEMBY
··································································· 6
3. TEST MODE
···································································· 13
4. MECHANICAL ADJUSTMENTS
····························· 17
5. ELECTRICAL ADJUSTMENTS
······························· 17
6. DIAGRAMS
6-1. Circuit Board Location ················································· 23
6-2. Block Diagrams ···························································· 24
6-3. Schematic Diagram BD Section ······························· 26
6-4. Printed Wiring Board BD Section ···························· 27
6-5. Printed Wiring Board Main Section ························· 28
6-6. Schematic Diagram Main Section (1/3) ··················· 29
6-7. Schematic Diagram Main Section (2/3) ··················· 30
6-8. Schematic Diagram Main Section (3/3) ··················· 31
6-9. Printed Wiring Board DSP Section ·························· 32
6-10. Schematic Diagram DSP Section (1/2) ··················· 33
6-11. Schematic Diagram DSP Section (2/2) ··················· 34
6-12. Printed Wiring Board OPT Section ························ 35
6-13. Schematic Diagram OPT Section ··························· 35
6-14. Printed Wiring Board Front Amp Section ··············· 36
6-15. Schematic Diagram Front Amp Section ················· 37
6-16. Schematic Diagram Surround Amp Section ··········· 38
6-17. Printed Wiring Board Surround Amp Section ········ 39
6-18. Printed Wiring Board Panel Section ······················· 40
6-19. Schematic Diagram Panel Section (1/2) ················· 41
6-20. Schematic Diagram Panel Section (2/2) ················· 42
6-21. Printed Wiring Board Leaf SW Section ·················· 43
6-22. Schematic Diagram Leaf SW Section ····················· 43
6-23. Printed Wiring Board Driver Section ······················ 44
6-24. Schematic Diagram Driver Section ························ 44
6-25. Printed Wiring Board Trans Section ······················· 45
6-26. Schematic Diagram Trans Section ·························· 46
6-27. IC Pin Function Description ······································· 47
6-28. IC Block Diagrams ····················································· 54
7. EXPLODED VIEWS
7-1. Main Section ································································· 58
7-2. Front Panel Section ······················································· 59
7-3. Chassis Section ····························································· 60
7-4. Tape Mechanism Deck Section-1 (TCM-230MWR41) 61
7-5. Tape Mechanism Deck Section-2 (TCM-230AWR41) 62
7-6. CD Mechanism Deck Section (CDM58E-30BD60) ···· 63
7-7. Base Unit Section (BU-30BD60) ································· 64
8. ELECTRICAL PARTS LIST
······································· 65
MODEL
AEP model
CND model
AUS model
KR model
MX model
AR model
PARTS No.
4-231-894-0
s
4-231-894-1
s
4-231-894-2
s
4-231-894-3
s
4-231-894-4
s
4-231-894-5
s