DR-BT50
2
TABLE OF CONTENTS
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
1. GENERAL
........................................................................... 3
2. DISASSEMBLY
2-1.
Disassembly Flow ························································ 4
2-2.
Housing (R) Assy ························································· 4
2-3.
Battery Holder ······························································ 5
2-4.
Main Board ·································································· 5
2-5.
Jack Board ···································································· 6
2-6.
Switch Board ································································ 6
2-7.
Mic Board ···································································· 6
3. DIAGRAMS
3-1.
Block Diagram ····························································· 9
3-2.
Printed Wiring Boards – Main Board – ····················· 10
3-3.
Printed Wiring Boards
– Jack, Mic and Switch Board – ····························· 11
3-4.
Schematic Diagram ···················································· 12
3-5.
IC Pinfunction Description ········································ 13
4. EXPLODED VIEWS
4-1. Housing (L) Section ···················································· 14
4-2. Housing (R) Section ···················································· 15
5. ELECTRICAL PARTS LIST
........................................ 16
• IC101 (CXN1450-2ABL), IC401 (WM8711LGEF/R) and
IC451 (uPD78F0500FC(S)-AA3-A) on MAIN board cannot
be replaced individually.
Replace it with “MAIN BOARD, COMPLETE”.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40
°
C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to
be applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set
to about 350
°
C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder
may also be added to ordinary solder.
CAUTION
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type.
Summary of Contents for DR-BT50 - Stereo Bluetooth Headset
Page 19: ...19 DR BT50 MEMO ...
