Sony DR-BT10CX Service Manual Download Page 10

10

DR-BT10CX

SECTION 4

ELECTRICAL PARTS LIST

Ref. No.

Part No.

Description

Remarks

Ref. No.

Part No.

Description

Remarks

NOTE:

Due to standardization, replacements in the
parts list may be different from the parts
specified in the diagrams or the components
used on the set.

-XX, -X mean standardized parts, so they
may have some difference from the original
one.

Items marked “*” are not stocked since they
are seldom required for routine service.
Some delay should be anticipated when
ordering these items.

CAPACITORS:
uF: 

µ

F

RESISTORS
All resistors are in ohms.
METAL: metal-film resistor
METAL OXIDE: Metal Oxide-film resistor
F: nonflammable

COILS
uH: 

µ

H

SEMICONDUCTORS
In each case, u: 

µ

, for example:

uA...: 

µ

A... , uPA... , 

µ

PA... ,

uPB... , 

µ

PB... , uPC... , 

µ

PC... ,

uPD..., 

µ

PD...

Abbreviation
CND: Canadian model
KR: Korean model

JACK

A-1216-556-A JACK BOARD, COMPLETE

*********************

< CONNECTOR >

CN251

1-816-868-21 CONNECTOR (POWER JACK)

< COIL >

L301

1-400-135-11 INDUCTOR

1uH

L302

1-400-135-11 INDUCTOR

1uH

************************************************************

A-1197-626-A MAIN BOARD, COMPLETE

*********************

< ANTENNA >

ANT101 1-754-380-11 HELICAL ANTENNA

< CAPACITOR >

C101

1-164-943-81 CERAMIC CHIP

0.01uF

10%

16V

C103

1-125-777-11 CERAMIC CHIP

0.1uF

10%

10V

C104

1-125-777-11 CERAMIC CHIP

0.1uF

10%

10V

C105

1-125-777-11 CERAMIC CHIP

0.1uF

10%

10V

C106

1-125-777-11 CERAMIC CHIP

0.1uF

10%

10V

C107

1-164-943-81 CERAMIC CHIP

0.01uF

10%

16V

C108

1-164-943-81 CERAMIC CHIP

0.01uF

10%

16V

C109

1-164-943-81 CERAMIC CHIP

0.01uF

10%

16V

C110

1-164-943-81 CERAMIC CHIP

0.01uF

10%

16V

C111

1-164-943-81 CERAMIC CHIP

0.01uF

10%

16V

C112

1-164-943-81 CERAMIC CHIP

0.01uF

10%

16V

C113

1-164-943-81 CERAMIC CHIP

0.01uF

10%

16V

C116

1-164-841-11 CERAMIC CHIP

1.5PF

0.25PF 50V

C118

1-119-923-11 CERAMIC CHIP

0.047uF

10%

10V

C119

1-119-923-11 CERAMIC CHIP

0.047uF

10%

10V

C120

1-164-854-11 CERAMIC CHIP

15PF

5%

50V

C121

1-100-506-91 CERAMIC CHIP

1uF

20%

6.3V

C122

1-162-964-11 CERAMIC CHIP

0.001uF

10%

50V

C123

1-164-943-81 CERAMIC CHIP

0.01uF

10%

16V

C125

1-164-874-11 CERAMIC CHIP

100PF

5%

50V

C126

1-164-874-11 CERAMIC CHIP

100PF

5%

50V

C131

1-164-874-11 CERAMIC CHIP

100PF

5%

50V

C132

1-164-874-11 CERAMIC CHIP

100PF

5%

50V

C133

1-164-874-11 CERAMIC CHIP

100PF

5%

50V

C134

1-164-874-11 CERAMIC CHIP

100PF

5%

50V

C151

1-164-943-81 CERAMIC CHIP

0.01uF

10%

16V

C201

1-100-844-91 TANTAL. CHIP

22uF

20%

10V

C202

1-125-777-11 CERAMIC CHIP

0.1uF

10%

10V

C203

1-164-943-81 CERAMIC CHIP

0.01uF

10%

16V

C204

1-125-777-11 CERAMIC CHIP

0.1uF

10%

10V

C205

1-112-017-91 TANTAL. CHIP

4.7uF

20%

10V

C207

1-100-450-91 TANTAL. CHIP

10uF

20%

6.3V

C208

1-125-777-11 CERAMIC CHIP

0.1uF

10%

10V

C209

1-164-943-81 CERAMIC CHIP

0.01uF

10%

16V

C210

1-100-506-91 CERAMIC CHIP

1uF

20%

6.3V

C211

1-125-777-11 CERAMIC CHIP

0.1uF

10%

10V

C212

1-100-506-91 CERAMIC CHIP

1uF

20%

6.3V

C255

1-125-777-11 CERAMIC CHIP

0.1uF

10%

10V

C261

1-112-324-91 CERAMIC CHIP

0.47uF

20%

10V

C262

1-100-506-91 CERAMIC CHIP

1uF

20%

6.3V

C263

1-164-937-11 CERAMIC CHIP

0.001uF

10%

50V

< CONNECTOR >

CN201

1-784-650-21 CONNECTOR 2P

< DIODE >

D102

6-501-537-01 DIODE   CL-191S-PP193-D-T (RED)

D103

6-501-538-01 DIODE   CL-191S-PB168-D-T (BLUE)

D201

8-719-082-45 DIODE   RB715W-TL

D303

1-804-209-21 VARISTOR (SMD)

< FERRITE BEAD >

FB101

1-469-084-21 FERRITE

0mH

FB102

1-469-084-21 FERRITE

0mH

FB103

1-469-084-21 FERRITE

0mH

FB104

1-469-084-21 FERRITE

0mH

< IC >

IC101

(Not supplied) IC   CXN1450-2ABL

IC151

6-709-935-01 IC   XC6109N16ANR

IC201

6-709-718-01 IC   XC9226A186MR

IC202

6-708-084-01 IC   XC6219B202MR

IC261

6-704-354-02 IC   BQ24010ADRCR

< CHIP CONDUCTOR >

J101

1-216-864-11 CONDUCTOR, CHIP

0

J102

1-216-864-11 CONDUCTOR, CHIP

0

J103

1-216-864-11 CONDUCTOR, CHIP

0

When indicating parts by reference
number, please include the board
name.

The components identified by
mark 

0

  or dotted line with mark

0

 are critical for safety.

Replace only with part number
specified.

Les composants identifiés par une
marque 

0

  sont critiques pour la

sécurité.
Ne les remplacer que par une
piéce portant le numéro spécifié.

• IC101 (CXN1450-2ABL) on MAIN board cannot be replaced

individually.
Replace it with “MAIN BOARD, COMPLETE”.

MAIN

Ver. 1.2

Summary of Contents for DR-BT10CX

Page 1: ...evices magnetic fields around a microwave oven static electricity reception sensitivity aerial s performance operating system software application etc 2 BLUETOOTH standard profiles indicate the purpose of BLUETOOTH Sony Corporation Personal Audio Division Published by Sony Techno Create Corporation 9 887 376 05 2007C02 1 2007 03 Headset Power source DC 3 7 V Built in lithium ion rechargeable batte...

Page 2: ... the iron tip has to be applied to the solder joint for a slightly longer time Soldering irons using a temperature regulator should be set to about 350 C Caution The printed pattern copper foil may peel away if the heated tip is applied for too long so be careful Strong viscosity Unleaded solder is more viscous sticky less prone to flow than ordinary solder so use caution not to let solder bridges...

Page 3: ...to normal produc tion tolerances Signal path F AUDIO NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS Caution Parts face side Parts on the parts face side seen from Side A the parts face are indicated Pattern face side Parts on the pattern face side seen from Side B the pattern face are indicated For printed wiring boards Note X parts extracted from the component side Y parts extracted from t...

Page 4: ...V TAPER V TERM VSET VI BAT VI SET VI SET V SLP VO REG VO REG VO REG VSET CHG ENABLE CHG ENABLE CHG ENABLE I FAULT ENABLE I DETECT ENABLE I FAULT ENABLE DEGLITCH DEGLITCH DEGLITCH DEGLITCH RECHARGE PRECHARGE TAPER TERM STAT1 REFERENCE AND BIAS THERMAL SHUTDOWN CHARGE CONTROL TIMER AND DISPLAY LOGIC PG PG TS IC261 BQ24010ADRCR IC Block Diagram ...

Page 5: ... PIO_07 IC202 2 0V REG A_IN_L_P MIC_P RECEIVER TRANSMITTER MIC AMP AF AMP BLUETOOTH CONTROL A_OUT_L_P A_OUT_L_N SP301 R CH 4 3 A_OUT_R_P A_OUT_R_N 47 1 3 5 37 IC151 IC101 4 1 RESET IC201 4 1 3 5 1 8V DC DC CONVERTER POWER SWITCH Q201 POWER ON OFF Q202 D201 STAT1 IC261 BATT 9 1 2 8 3 OUT LI ION BATTERY CHARGE MANAGEMENT 10 TS IN VCC CN201 LI ION RECHARGEABLE BATTERY 3 7V B301 CN251 BATTERY CHARGING...

Page 6: ...03 FB104 R133 R134 IC261 S305 S307 C131 C132 R107 R109 R110 R108 C133 L102 C116 CN251 D303 MULTI FUNCTION 1 2 3 4 SIDE A BOARD SWITCH BOARD MAIN SIDE A SIDE A BOARD JACK 11 11 1 871 239 11 11 1 871 238 11 11 1 870 895 A MAIN BOARD SIDE A Page 7 RED BLK 2 3 4 5 6 7 A 1 B C D 2 2 PRINTED WIRING BOARD MAIN BOARD SIDE A Uses unleaded solder Ref No Location D102 C 5 D103 C 6 D303 B 4 IC101 C 3 IC151 C ...

Page 7: ...25 NATURAL RED GRN NATURAL GRN C126 R115 L103 C134 R114 L301 L302 R152 L104 J101 J103 J102 MIC301 HEADPHONE DR EX51PT SP302 L CH SP301 R CH SIDE B BOARD MAIN RECHARGEABLE BATTERY LI ION 3 7V 11 11 1 871 238 1 3 1 3 4 4 5 5 11 11 1 870 895 11 11 1 871 239 SIDE B BOARD JACK SIDE B BOARD SWITCH E C C B B MIC A JACK BOARD SIDE B Page 6 RED BLK 2 3 4 5 6 7 A 1 B C D 2 3 PRINTED WIRING BOARD MAIN BOARD ...

Page 8: ...01 D303 L102 S104 R113 POWER_HOLD 1 8V CXN1450 XC6109N16ANR XC9226A186MR XC6219B202MR BQ24010ADRCR 0 47 0 1 2P 2P C6027CD423LFP 1000p 1 15pF 15nH 0 047 0 047 0 2 2k 1000p 10k 10k 5 1k 0 5 470 0 5 1 100 470 0mH 0mH 10 10 100p 100p 0mH 10 0mH 10 100p 100p 0 1 150k 0 5 0 1 0 01 100k 0 1 0 01 0 1 1 4 7 10V 47k 100k RB715W 100k 0 01 470k 0 1 10 6 3V 150k 0 01 150k 0 01 150k 0 01 150k 0 01 150k 0 01 47k...

Page 9: ... LOWER SUB ASSY 3 8 912 760 90 HEADPHONE DR EX51PT SET 4 2 688 503 01 BUTTON VOLUME 5 X 2159 958 1 LITHIUM ION BATTERY SUB ASSY AEP UK E KR 5 X 2178 102 1 LITHIUM ION BATTERY SUB ASSY US CND 6 2 683 433 01 SHEET PROTECTION 7 2 693 055 01 SHEET BATTERY 8 2 890 550 01 SHEET COIL B 9 2 890 005 01 SHEET COIL 10 A 1197 623 A MAIN PC BOARD ASSY 11 A 1197 716 A SWITCH BOARD COMPLETE 12 A 1216 556 A JACK ...

Page 10: ...16V C125 1 164 874 11 CERAMIC CHIP 100PF 5 50V C126 1 164 874 11 CERAMIC CHIP 100PF 5 50V C131 1 164 874 11 CERAMIC CHIP 100PF 5 50V C132 1 164 874 11 CERAMIC CHIP 100PF 5 50V C133 1 164 874 11 CERAMIC CHIP 100PF 5 50V C134 1 164 874 11 CERAMIC CHIP 100PF 5 50V C151 1 164 943 81 CERAMIC CHIP 0 01uF 10 16V C201 1 100 844 91 TANTAL CHIP 22uF 20 10V C202 1 125 777 11 CERAMIC CHIP 0 1uF 10 10V C203 1 ...

Page 11: ...220K 0 5 1 16W R102 1 208 939 11 METAL CHIP 150K 0 5 1 16W R104 1 218 979 11 RES CHIP 150K 5 1 16W R105 1 218 979 11 RES CHIP 150K 5 1 16W R106 1 218 979 11 RES CHIP 150K 5 1 16W R107 1 218 979 11 RES CHIP 150K 5 1 16W R108 1 218 973 11 RES CHIP 47K 5 1 16W R109 1 218 979 11 RES CHIP 150K 5 1 16W R110 1 218 979 11 RES CHIP 150K 5 1 16W R111 1 218 965 11 RES CHIP 10K 5 1 16W R112 1 218 965 11 RES C...

Page 12: ...n at the upper right on the revised page allows you to jump to the next revised page Ver Date Description of Revision 1 0 2006 08 New 1 1 2006 08 Delete of manual instruction 2 SPM 06098 1 2 2006 12 Addition of Korean model 1 3 2007 01 Part No addition of Ref No 5 US CND SPM 07002 1 4 2007 03 Addition of E model ...

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