– 13 –
– 14 –
– 15 –
– 16 –
DP-IF5000
5-3. PRINTED WIRING BOARD — PROCESSOR, TRANSMITTER SECTION —
TP L
TP R
( )
( )
1
A
B
C
D
E
F
G
H
I
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
Note:
•
X
: parts extracted from the component side.
•
®
: Through hole.
•
b
: Pattern from the side which enables seeing.
(The other layer’s patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen from the
(Side B)
pattern face are indicated.
Parts face side:
Parts on the parts face side seen from the
(Side A)
parts face are indicated.
D1
G-3
D51
F-3
D101
H-9
D102
H-9
IC1
F-4
IC101
F-9
IC102
F-6
IC103
E-8
IC105
B-3
IC201
D-2
IC202
D-3
IC204
E-4
IC301
C-7
IC302
C-5
IC303
D-6
IC304
E-6
(IC305)
C-12
(IC801)
H-14
(IC802)
I-7
(IC803)
C-12
(IC804)
I-14
(IC805)
H-17
Q1
G-3
Q2
H-2
Q31
F-3
Q32
G-3
Q33
F-5
Q34
F-4
Q35
G-4
Q36
G-5
Q51
F-3
Q52
F-2
Q101
F-9
Q102
G-9
Q803
H-8
• Semiconductor
Location
Ref. No.
Location
(
) : SIDE B
(Page 25)
(Page 22)
(Page 22)